Gas-barrier laminate film

A laminated film and gas-barrier technology, applied in the field of gas-barrier laminated film and its manufacture, can solve the problems of insufficient performance and the like

Inactive Publication Date: 2013-07-03
MITSUBISHI PLASTICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the gas barrier film is formed by various methods such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). 2 Oxygen transmission rate (OTR) around / day, 2g / m 2 The water vapor transmission rate (WVTR) of about / day is not sufficient for applications that require higher gas barrier properties.

Method used

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  • Gas-barrier laminate film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] Using a biaxially oriented polyethylene naphthalate film (manufactured by DuPont Teijin, "Q51C12") with a width of 1.2 m, a length of 12000 m, and a thickness of 12 μm as a base material film, the corona-treated surface was coated with an isocyanate compound ( "CORONATE L" manufactured by Nippon Polyurethane Industry) and saturated polyester ("BYRON300" manufactured by Toyobo, number average molecular weight 23,000) were mixed at a mass ratio of 1:1 and dried to form a bottom layer with a thickness of 100nm Adhesion layer.

[0119] Next, using a vacuum evaporation apparatus at 2 x 10 -3 SiO was evaporated by high-frequency heating under a vacuum of Pa, and a vacuum-evaporated film (PVD film) of SiOx with a thickness of 40 nm was formed on the bottom adhesion-promoting layer. Next, in the same vacuum evaporation device, without returning the pressure to atmospheric pressure, HMDSN (hexamethyldisilazane), nitrogen gas and argon gas were introduced at a molar ratio of 1:7...

Embodiment 2

[0122] A laminated film was produced in the same manner except that the CVD inorganic thin film layer and the vacuum evaporated film layer (PVD inorganic thin film layer) in Example 1 were sequentially formed into one layer under the same conditions as in Example 1. The above-mentioned evaluation was performed on the obtained laminated film. The results are shown in Table 1.

Embodiment 3

[0124] A laminated film was produced in the same manner except that the formation of the CVD inorganic thin film layer in Example 1 was repeated twice under the same conditions as in Example 1 so that the CVD inorganic thin film layer had a two-layer structure. The above-mentioned evaluation was performed on the obtained laminated film. The results are shown in Table 1.

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Abstract

Provided are: a gas-barrier laminate film which can be produced with good productivity, has high transparency and high gas barrier properties, has excellent interlayer adhesion strength among constituent layers thereof, and cannot be curled; and a process for producing the film. The gas-barrier laminate film comprises an inorganic thin film layer formed by a vacuum deposition technique, an inorganic thin film layer formed by a chemical deposition technique and an inorganic thin film layer formed by a vacuum deposition technique which are formed in this order on at least one surface of a base film, wherein each of the inorganic thin film layers formed by the vacuum deposition technique has a thickness of 0.1 to 500 nm inclusive and the inorganic thin film layer formed by the chemical deposition technique has a carbon content of not less than 0.5 at% and less than 20 at.% and a thickness of smaller than 20 nm.

Description

technical field [0001] The present invention relates to a gas-barrier laminated film mainly used as packaging materials for foods, pharmaceuticals, etc., packaging materials for electronic devices, etc., electronic paper, materials for solar cells, etc., and a production method thereof. More specifically, the present invention relates to Gas-barrier multilayer film having a silicon oxide film excellent in gas-barrier property and method for producing the same. Background technique [0002] The uses of gas barrier films are mainly concentrated on: in order to prevent the influence of oxygen, water vapor, etc. Elements such as display panels, EL display panels, electronic paper, and solar cells are used as packaging materials for electronic devices, etc., or materials for electronic paper and solar cells due to performance degradation caused by contact with oxygen and water vapor. In addition, in recent years, a gas barrier film is sometimes used for reasons such as imparting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00C23C14/06C23C16/30
CPCC23C16/30C23C14/10Y10T428/24975B32B9/00B32B27/06C23C14/06H05K5/0213
Inventor 山内康嗣吉田重信蜂须贺亨木村繁人
Owner MITSUBISHI PLASTICS INC
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