Flexible LED device with wire bond free die

Abstract

An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Description

technical field [0001] The present invention relates to flexible high power light emitting semiconductor devices. Background technique [0002] Conventional light emitting semiconductor (LES) devices (LESDs), including light emitting diodes (LEDs) and laser diodes, and packages containing LESDs have several disadvantages. High power LESDs generate a considerable amount of heat that must be managed. Thermal management deals with issues arising from heat dissipation and thermal stress, which are currently the key factors limiting the performance of LEDs. [0003] In general, LES devices are often susceptible to damage from the build-up of heat generated within the device and, in the case of external lighting applications, from sunlight. Excessive heat buildup can lead to degradation of materials used in LES devices, such as encapsulants for LESDs. When the LESD is attached to a flex circuit laminate (which may also include other electrical components), the heat dissipation ...

AI Technical Summary

Problems solved by technology

Excessive heat buildup can lead to degradation of materials used in LES devices, such as encapsulants for LESDs

Heat dissipation concerns are greatly increased when LESDs are attached to a flex circuit laminate (which may also include other electrical components)

[0004] Additionally, conventional LES devices and packages tend to be thick, which limits their use in low form factor (loW form factor) applications

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