Packaging machine and packaging method for dual-interface card

A dual-interface card, packaging machine technology, applied in auxiliary devices, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., can solve the problems of unstable welding, high product defect rate, slow speed, etc.

Inactive Publication Date: 2013-07-10
SHENZHEN FINESUN PRECISION MACHINERY & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing machines on the market are all single-unit dual-interface card packaging machines, which are used to package dual-interface chips. It requires manual operation by workers, and additional matching structures are required to achieve semi-automatic operation. The speed is slow and the welding is unstable, resulting in The defective rate of the produced products is high, and the defective products are not found in time

Method used

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  • Packaging machine and packaging method for dual-interface card
  • Packaging machine and packaging method for dual-interface card
  • Packaging machine and packaging method for dual-interface card

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Embodiment Construction

[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] One embodiment of the present invention is a packaging machine for dual-interface cards, which includes the following devices: card loading arm, Y-direction antenna correction group, chip steering group, antenna correction butt welding group, CCD detection group, chip push-down group , The first non-contact detection group, the correction spot welding group, the first heat welding group, the second heat welding group, the cold welding group, the contact detection group, the second non-contact detection group and the cassette group. like figure 1 , 2 As shown, an embodiment of the present invention includes a card-in transfer arm 101, a Y-direction antenna correction group 102, an antenna correction butt welding group 103, a chip steering group 104, a chip pull strip group 105, a chip punching die 106, and a chip placement Strip group...

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Abstract

The invention discloses a packaging machine and a packaging method for a dual-interface card. The packaging machine comprises a card-in carrying arm, a Y-direction antenna correction group, a chip turning group, an antenna correction butt-welding group, a charge coupled device (CCD) detection group, a chip push-over group, a first non-contact detection group, a correction spot-welding group, a first hot-welding group, a second hot-welding group, a cold-welding group, a contact detection group, a second non-contact detection group and a cartridge group. By adoption of the scheme, the packaging machine packages a chip of the dual-interface card on the dual-interface card with an antenna selected mechanically or manually, achieves the technical effect of automatic packaging, and can be operated singly or operated by connecting with other equipment. During single operation, automatic card distribution operation and automatic packaging can be realized only by placing the card base with the selected antenna on a material-discharging conveying belt without manual operation, and the operation is flexible and convenient.

Description

technical field [0001] The invention relates to a packaging technology for a dual-interface card, in particular to a packaging machine and a packaging method for a dual-interface card. Background technique [0002] According to the reading and writing methods of smart cards, it can be divided into contact IC cards and non-contact IC cards. The functions of the above two cards are combined on one card as a dual-interface card. [0003] The existing machines on the market are all single-unit dual-interface card packaging machines, which are used to package dual-interface chips. It requires manual operation by workers, and additional matching structures are required to achieve semi-automatic operation. The speed is slow and the welding is unstable, resulting in The defective rate of the products produced is high, and defective products are not found in time. [0004] Therefore, there are defects in the prior art and need to be improved. Contents of the invention [0005] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K31/02B23K37/00
Inventor 向泽亮
Owner SHENZHEN FINESUN PRECISION MACHINERY & TECH CO LTD
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