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Heating floor

A floor and floor board technology, applied in heating methods, electric heating systems, household heating, etc., can solve the problems of large wire usage, high cost, complicated wiring, etc., save time and effort in the installation process, avoid leakage phenomenon, and reduce costs cheap effect

Inactive Publication Date: 2013-07-10
XINXIANG CITY WOMUER HEATING EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the laying process of the heating floor, each floor board needs to be connected with the corresponding wire, and the floor boards of the indoor floor are connected in parallel, so that the use of wires in the whole laying process is extremely large, resulting in high cost.
In addition, the general indoor floor laying process requires laying hundreds of floor boards, resulting in very complicated wiring, inconvenient installation, time-consuming and laborious, and a high failure rate during use

Method used

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Embodiment Construction

[0012] Embodiments are described in detail with reference to the accompanying drawings. A heating floor, including a plurality of assembled floorboards, each floorboard mainly includes a substrate 1, a surface layer 2 and a conductive heating layer arranged between the substrate and the surface layer, wherein the substrate 1 is a high-temperature reinforced composite board, The surface layer 2 is a wooden floor, and the conductive heating layer is a carbon crystal plate. The carbon crystal plate includes a heating carbon crystal 3 and an epoxy resin plate 6 coated on both sides of the heating carbon crystal. The conductive heating layer and the substrate 1 Copper foil 4 is arranged in between, and the two sides of the substrate 1 are respectively perforated. The conductive heating layer opposite to the substrate 1 and the two sides of the copper foil 4 are respectively provided with contacts 5, and the contacts 5 are respectively connected with wires passing through the substra...

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Abstract

The invention discloses a heating floor. According to the technical scheme, the heating floor comprises a plurality of spliced floor plates. Each floor plate mainly comprises a base plate, a surface layer and a conductive heating layer arranged between the base plate and the surface layer. Copper foil is arranged between the conductive heating layer and the base plate. Two sides of the base plate are provided with through holes. Two sides of the conductive heating layer and the copper foil, opposite to the base plate, are respectively provided with contacts. Leads are respectively connected by contacts and penetrate through the corresponding through holes on the base plate, leads on one side is connected with a sealing plug, and leads on the other side is connected with a sealing socket. The heating floor is higher in safety, low in cost, convenient to mount and mainly applied to indoor warming.

Description

technical field [0001] The invention relates to the technical field of indoor floors, in particular to a heating floor. Background technique [0002] At present, in the laying process of the heating floor, each floor board needs to be connected with the corresponding wire, and the floor boards of the indoor floor are connected in parallel, so that the use of wires in the whole laying process is extremely large, resulting in high cost. . In addition, the general indoor floor laying process requires laying hundreds of floor boards, resulting in very complicated wiring, inconvenient installation, time-consuming and laborious, and a high failure rate during use. Contents of the invention [0003] The technical problem solved by the invention is to provide a heating floor with higher safety, low cost and convenient installation. [0004] The technical solution of the present invention is: a heating floor, including a plurality of assembled floor boards, each floor board mainl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D13/02E04F15/02
Inventor 贾强
Owner XINXIANG CITY WOMUER HEATING EQUIP CO LTD
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