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Packaging structure of flat plate type oxygen sensor

An oxygen sensor and packaging structure technology, applied in the field of flat oxygen sensor packaging structure, can solve the problems of complex packaging process, poor contact between chip electrode pins and wire terminals 8, and reliable conduction, etc., and achieve simple and convenient assembly , The assembly process is simple and easy to operate, and the effect of not easy to slide and leak air

Inactive Publication Date: 2013-07-10
WUXI LONGSHENG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaging process of the chip electrode pins 15 and 17 of this structure is also relatively complicated, and it is easy to cause the chip electrode pins to not be in good contact with the wire terminals 8, resulting in inability to conduct reliably.

Method used

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  • Packaging structure of flat plate type oxygen sensor
  • Packaging structure of flat plate type oxygen sensor
  • Packaging structure of flat plate type oxygen sensor

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Experimental program
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Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.

[0029] A package structure of a planar oxygen sensor, such as image 3 shown. The oxygen sensor chip 1 is sealed in the base 3 , and the outer cylindrical surface of the base 3 is provided with an external thread 31 . The middle section of the chip 1 is located in the central hole of the upper positioning ceramic part 6, the sealing powder block 4 and the lower positioning ceramic part 5, and the base is set on the outside of the upper positioning ceramic part 6, the sealing powder block 4 and the lower positioning ceramic part 5.

[0030] The above-mentioned lower positioning ceramic part 5, sealing powder block 4 and upper positioning ceramic part 6 are all cylindrical structures, wherein the upper positioning ceramic part 6 is two sections of cylinders connected with different diameters, and the first section of the upper positioning ...

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Abstract

The invention discloses a packaging structure of a flat plate type oxygen sensor. The packaging structure is mainly characterized in that a socket and the structure of an upper positioning ceramic piece are structurally improved, wherein the socket is used for positioning and sealing an oxygen sensor chip, the conduction structure of chip electrode pins and wire terminals is improved, and a probe cover for protecting the head of the chip is improved, so that the oxygen sensor chip is simple in assembly process and easy to assemble, a signal of a packaged chip can be effectively conducted, the leakage of gas can be effectively prevented on the basis of effectively detecting the gas, and the detection accuracy of the oxygen sensor is greatly improved.

Description

technical field [0001] The invention relates to the field of a gas sensor for vehicles, in particular to a package structure of a flat-plate oxygen sensor. Background technique [0002] The gas sensor is installed on the exhaust pipe of the engine to detect the concentration of a certain gas in the exhaust gas of the vehicle. Its core component is generally a strip-shaped flat sensor chip. The most commonly used gas sensor is a flat oxygen sensor. The flat oxygen sensor measures the concentration of oxygen in the exhaust gas and feeds back the measured results to the engine controller. The engine controller optimizes the combustion state based on this, so as to minimize the emission of harmful substances. The structure of the planar oxygen sensor chip is as follows: figure 1 As shown, one end of the test gas of the chip 1 is attached with an external electrode 11, which is in contact with the exhaust gas; the chip 1 is provided with an air cavity 13 channel, which is opened...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/00
Inventor 肖琳
Owner WUXI LONGSHENG TECH
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