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Solder splash stirring method

A stirring method and tin slag technology, which is applied to mixer accessories, chemical instruments and methods, mixers with rotating stirring devices, etc., can solve the problems of tin slag stirring efficiency drop, transmission gear locking, etc.

Inactive Publication Date: 2013-07-24
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problem in the prior art that the transmission gear is stuck during the stirring of tin slag, resulting in a decrease in the stirring efficiency of tin slag, the present invention provides a stirring method for tin slag, including:

Method used

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Examples

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Embodiment 1

[0038] This embodiment discloses a stirring method of tin slag, such as figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 As shown, the method includes:

[0039] providing a soldering pool with tin liquid in the soldering pool;

[0040] The tin slag stirring device is provided on the solder pool, and the tin slag stirring device includes a support 4, a motor 10 that fixes the upper end of the support and the output shaft is vertically downward for providing power, and is fixed on the support for transmitting power. The gear and the stirring assembly fixed on the bracket are used to stir the tin slag after receiving the power;

[0041] The transmission gear comprises a first bevel gear 21 placed vertically and a second bevel gear 23 matched with the first bevel gear, and the first bevel gear drive shaft 22 is connected with the motor output shaft;

[0042] Controlling the position of the stirring device in the soldering pool, so that the first bevel gear and the s...

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PUM

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Abstract

The invention provides a solder splash stirring method, comprising: providing a soldering pool, which contains molten tin; a solder splash stirring device is arranged on the soldering pool, and the solder splash stirring device comprises a rack, an electric motor for fixing the rack, a transmission gear and a stirring assembly; the transmission gear comprises a first umbrella tooth and a second umbrella tooth matched to the first umbrella tooth, and a transmission shaft of the first umbrella tooth is connected to an output shaft of the electric motor; positions of the stirring device in the soldering pool are controlled, to make the first umbrella tooth and the second umbrella tooth be dipped in the molten tin, and to make the electric motor lie in the upper of the soldering pool and have a preset distance away from the soldering pool; the electric motor is started, the first umbrella tooth drives the second umbrella tooth to rotate after receiving the power output by the electric motor, and the second umbrella tooth rotates to drive the stirring assembly to stir the solder splash; gears of the umbrella teeth can be dipped in the molten tin, and the electric motor is fixed on the upper of the rack, and has a certain distance away from the solder splash, and the gears of the umbrella teeth dipped in the molten tin will not be blocked by the solder splash.

Description

technical field [0001] The invention relates to the field of soldering, in particular to a method for stirring tin slag. Background technique [0002] A typical type of soldering in the existing soldering technology is wave soldering. In the wave soldering process, due to the production process itself, the tin material is often not fully utilized, and tin slag is often left. Therefore, in order to save resources and reduce costs, it is necessary to To recycle tin slag, the existing tin slag agitator is a common equipment for recycling tin slag. It has a motor, a gearbox, a stirring component and a recovery basket. Its working principle is that the motor drives the transmission gear to run, and the transmission gear further drives the stirring The component rotates to complete the stirring of the tin slag, and the stirred residue is sent to the recovery basket for reuse. [0003] In wave soldering, since the motor needs to be kept above the tin solder bath and at a predeterm...

Claims

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Application Information

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IPC IPC(8): B01F7/02B01F15/00B02C4/30B02C4/02
Inventor 胡海涛伍华华