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A preparation method of an aluminum-based cover plate used for micro-aperture drilling of printed circuit boards

A printed circuit board and tiny technology, applied in the field of preparation of aluminum-based cover plates, can solve the problems of moisture absorption and sticky coating surface, and achieve the effect of improving compatibility, excellent lubricating performance, and solving stickiness

Active Publication Date: 2015-12-23
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to aim at the above-mentioned defects existing in the prior art, and provide a new preparation method of an aluminum-based cover plate used for micro-aperture drilling of printed circuit boards. Excellent positioning accuracy, reduce the roughness of the hole wall, and solve problems such as stickiness and serious moisture absorption on the coating surface

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Weigh 34 kg of hexamethylene diisocyanate, 100 kg of polybutylene adipate diol (number average molecular weight of 1000), 0.1 kg of dibutyltin laurate, and 100 kg of dimethylformamide React in the reactor for 3 hours; then add 12 kg of ethylene glycol and 17 kg of hexamethylene diisocyanate to continue the reaction for 3 hours, then add 63 kg of dimethylformamide to prepare the first polyurethane quality A solution with a percentage content of 50%; (2) Weigh 34 kg of hexamethylene diisocyanate, 150 kg of polyethylene glycol (number average molecular weight 1500), 0.1 kg of zinc octoate, and 100 kg of dimethylformamide The components reacted in the reactor for 3 hours; then added 12 kg of ethylene glycol and 17 kg of hexamethylene diisocyanate to continue the reaction for 3 hours, and then added 113 kg of dimethylformamide to prepare the second A solution with a polyurethane mass percentage of 50%; (3) mix the first polyurethane solution and the second polyurethane s...

Embodiment 2

[0030] (1) Weigh 44 kg of isophorone diisocyanate, 300 kg of polyethylene adipate diol (number average molecular weight 3000), 0.14 kg of zinc octoate, and 300 kg of dimethylformamide React in the reactor for 3 hours; then add 18 kg of 1,4-butanediol and 22 kg of isophorone diisocyanate to continue the reaction for 3 hours, then add 84 kg of dimethylformamide to prepare the first (2) weigh 44 kilograms of isophorone diisocyanate, 450 kilograms of polyethylene glycol (the number average molecular weight is 4500), 0.15 kilograms of dibutyltin laurate, 400 kilograms of dibutyltin laurate, The components of methyl acetamide were reacted in the reactor for 3 hours; 24 kg of hexanediol and 22 kg of isophorone diisocyanate were added to continue the reaction for 3 hours, and then 140 kg of dimethylacetamide was added to prepare into a second polyurethane solution with a mass percentage of 50%; (3) mix the first polyurethane solution and the second polyurethane solution at a mass rati...

Embodiment 3

[0033] (1) Weigh 52 kg of dicyclohexylmethane diisocyanate, 600 kg of polyethylene adipate diol (number average molecular weight 6000), 0.20 kg of zinc octoate, and 500 kg of dimethylformamide React in the reactor for 3 hours; then add 24 kg of hexanediol and 26 kg of dicyclohexylmethane diisocyanate to continue the reaction for 3 hours, then add 202 kg of dimethylformamide to prepare the first polyurethane mass percent 50% solution; (2) Weigh 52 kg of dicyclohexylmethane diisocyanate, 600 kg of polyethylene glycol (number average molecular weight 6000), 0.2 kg of dibutyltin laurate, 500 kg of dimethylacetamide The components were reacted in the reactor for 3 hours; 24 kg of ethylene glycol and 26 kg of dicyclohexylmethane diisocyanate were added to continue the reaction for 3 hours, and then 202 kg of dimethylformamide was added to prepare the second polyurethane quality 50% solution; (3) Mix the first polyurethane solution and the second polyurethane solution according to th...

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PUM

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Abstract

The invention discloses a preparation method of an aluminum-base cover plate for drilling small-diameter holes in a printed circuit board, which comprises the following steps: reacting diisocyanate, polyesterglycol, catalyst and solvent in a reactor, adding chain extender and diisocyanate to continue the reaction, and adding solvent to prepare a first polyurethane solution; reacting the diisocyanate, polyethyleneglycol, catalyst and solvent in a reactor filled with nitrogen gas; adding chain extender and diisocyanate to continue the reaction, and adding solvent to prepare a second polyurethane solution; evenly mixing the two polyurethane solutions while stirring at high speed, adding non-ionic surfactant, evenly mixing, and deaerating in a vacuum to obtain a mixed solution; and coating the mixed solution onto the upper surface of an aluminum foil in a roller coating or scratch coating mode, drying and cooling to obtain the product. The product of the invention can lower the drilling breaking rate, enhance the positioning accuracy and reduce the roughness of the hole wall, thereby solving the problem that the coating surface is sticky, severely absorbs moisture and the like.

Description

technical field [0001] The invention belongs to the technical field of chemical industry and preparation of special materials, and in particular relates to a preparation method of an aluminum-based cover plate used for micro-aperture drilling of printed circuit boards. Background technique [0002] Printed circuit boards are also called printed circuit boards, or printed boards for short. The printed board is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. It is called the "mother of electronic products". Usually, when the printed board is used in practice, due to the needs of wiring, structure, overcurrent, etc., drilling operations are required. In order to protect the printed board and improve the hole position accuracy and hole wall quality of the drilled hole, it is often necessary to put a layer of cover material when the printed board is drilled. Generally, the quality of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D175/08C09D175/06C09D7/12C08G18/66C08G18/48C08G18/42B32B15/095
Inventor 周虎郭家旺蒋敏唐珍刘苗吴鹏王存
Owner SHENZHEN NEWCCESS IND