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Substrate processing apparatus and substrate processing method

A technology of a substrate processing device and a substrate processing method, which is applied in the directions of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of stable maintenance and prevention of position dislocation

Inactive Publication Date: 2013-08-14
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] In addition, in the decompression drying unit 50 as described above, there is almost no gap between the substrate G and the mounting table 53 even though the fixing pins 54 are interposed. Therefore, it is difficult to directly load the substrate G by a transfer robot arm (not shown). placed on stage 53

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Embodiment Construction

[0058] Hereinafter, one embodiment of the present invention will be described based on the drawings. In addition, the substrate processing apparatus and substrate processing method of the present invention can be applied, for example, to a reduced-pressure drying unit in a coating processing section for forming a resist film as a coating film on a glass substrate as a substrate to be processed in a photolithography process.

[0059] figure 1 It is a plan view of a coating processing part equipped with a reduced-pressure drying unit as a substrate processing apparatus of the present invention, figure 2 yes figure 1 The side view of the coating treatment part.

[0060] Such as figure 1 , figure 2 As shown, in the coating processing unit 1, a resist coating unit 4 having a nozzle 3 and a resist coating unit 4 to be coated on a glass substrate G are arranged in a row in a row in the horizontal direction (X direction) on the support table 2 in accordance with the order of ...

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Abstract

The invention provides a substrate processing apparatus and a substrate processing method, wherein when a to-be-processed substrate is moved in or out relative to a carrying bench, the substrate is kept stable and is prevented from being misplaced. The substrate processing apparatus comprises a carrying bench (11) capable of loading a to-be-processed substrate (G); a plurality of supporting pins (16) disposed around the carrying bench in a liftable manner and used for upwardly supporting the to-be-processed substrate in the lifted position; and a supporting pin lifting mechanism (17) used for moving the plurality of supporting pins in the vertical direction.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method. For example, the present invention relates to a substrate processing apparatus and a substrate processing method for placing a substrate to be processed coated with a processing liquid on a stage and performing a predetermined process on the substrate. Background technique [0002] For example, in the manufacture of FPD (Flat Panel Display, flat panel display), after forming a predetermined film on a substrate to be processed such as a glass substrate, a photoresist (hereinafter referred to as a resist) as a processing liquid is applied to A resist film is formed, exposed to light according to the circuit pattern, and developed, that is, a circuit pattern is formed by a photolithography process. [0003] In the step of forming the above-mentioned resist film, after the resist is applied to the substrate, a reduced-pressure drying treatment is performed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCG03F7/38H01L21/0273H01L21/6838H01L21/68742
Inventor 植田稔彦古家高广
Owner TOKYO ELECTRON LTD
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