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Multi-module parallel test system and multi-module parallel test method

A parallel testing, multi-module technology, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problem of large signal interference, and achieve the effect of reducing signal interference and improving reliability.

Active Publication Date: 2013-08-28
SINO IC TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-module parallel test system and test method to solve the problem of large signal interference in the existing multi-module parallel test system

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  • Multi-module parallel test system and multi-module parallel test method

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Embodiment Construction

[0022] The multi-module parallel test system and test method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0023] Please refer to figure 1 , which is a schematic diagram of a frame structure of a multi-module parallel testing system according to an embodiment of the present invention. Such as figure 1 As shown, the multi-module parallel test system 1 includes: an ATE driver module 10; a probe card 11, the probe card 11 is signal-connected to the ATE driver module 10, and the probe card 11 includes multiple groups of probes ( figure 1 not shown), each...

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Abstract

The invention provides a multi-module parallel test system and a multi-module parallel test method. The multi-module parallel testing system comprises an ATE drive module and a probe card, wherein the probe card is in signal connection with the ATE drive module. The probe card comprises a plurality of sets of probes, and each set of probes comprises a main probe and an additional probe. According to the multi-module parallel test system and the multi-module parallel test method, each set of probes is provided with the additional probe, interference signals can be effectively focused into the additional probes so as to prevent the main probes from receiving the interference signals, therefore signal interference in a multi-module parallel test is avoided or reduced, and reliability of the multi-module parallel test is improved.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a multi-module parallel testing system and testing method. Background technique [0002] Electrical testing of integrated circuit chips (integrated circuit chips, IC chips) is very important in all stages of semiconductor manufacturing processes (semiconductor process). Every IC chip must be tested to ensure its electrical function. [0003] With the improvement of IC chip design capabilities, currently the main products in chip-level testing are SoC architectures, which embed a large number of IP cores inside the chip. These IP cores include both digital IP cores and analog IP cores, such as LDO, ADCs, DACs, etc. As IC chips become more integrated and more complex, the difficulty and cost of testing are also rising. At the same time, due to the requirements of market competition and cost pressures, the time to market and test costs of chips have also been squeezed to an ...

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Application Information

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IPC IPC(8): G01R31/28G01R1/073
Inventor 罗斌祁建华张志勇徐惠牛勇郝丹丹
Owner SINO IC TECH