Method for separating elements and solder from waste printed circuit board
A technology for printed circuit boards and separation components, applied in the field of separation components and solder, can solve the problems of poisonous, harmful fumes, large quantities, etc., and achieve the effects of not being easily damaged, low heating costs, and low energy consumption
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Embodiment 1
[0035] The method for separating components and solder from waste printed circuit boards in this embodiment is:
[0036] According to the mass percentage, 10% of the brown corundum particles with a particle size of 2-3mm, 50% of the brown corundum particles with a particle size of 1-2mm, and 40% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 350°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 4 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that the welding surface is facing upwards and the component surface is facing downwards, and a ...
Embodiment 2
[0038] The method for separating components and solder from waste printed circuit boards in this embodiment is:
[0039]According to the mass percentage, 30% of the brown corundum particles with a particle size of 2-3mm, 50% of the brown corundum particles with a particle size of 1-2mm and 20% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 370°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that its soldering surface faces upwards and the component faces downwards, and the high-frequency...
Embodiment 3
[0041] The method for separating the components and solder from the waste printed circuit board in this example is:
[0042] According to the mass percentage, 10% of the brown corundum particles with a particle size of 2-3mm, 60% of the brown corundum particles with a particle size of 1-2mm and 30% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 380°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3.5 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that its soldering surface faces upwards and the component faces downwards, and the high-fr...
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