Method for separating elements and solder from waste printed circuit board

A technology for printed circuit boards and separation components, applied in the field of separation components and solder, can solve the problems of poisonous, harmful fumes, large quantities, etc., and achieve the effects of not being easily damaged, low heating costs, and low energy consumption

Inactive Publication Date: 2013-09-11
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has two disadvantages. One is that the liquid solder will produce a large amount of toxic and harmful fumes during the heating process (including heavy metal lead in the solder, fumes volatilized from the circuit board substrate and components, etc.), and the other is that the fumes from the liquid solder When the surface removes the circuit board, the soldering surface will take away the expensive solder in the tin pot, and as time goes by, the solder in the tin pot will become less and less

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The method for separating components and solder from waste printed circuit boards in this embodiment is:

[0036] According to the mass percentage, 10% of the brown corundum particles with a particle size of 2-3mm, 50% of the brown corundum particles with a particle size of 1-2mm, and 40% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 350°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 4 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that the welding surface is facing upwards and the component surface is facing downwards, and a ...

Embodiment 2

[0038] The method for separating components and solder from waste printed circuit boards in this embodiment is:

[0039]According to the mass percentage, 30% of the brown corundum particles with a particle size of 2-3mm, 50% of the brown corundum particles with a particle size of 1-2mm and 20% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 370°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that its soldering surface faces upwards and the component faces downwards, and the high-frequency...

Embodiment 3

[0041] The method for separating the components and solder from the waste printed circuit board in this example is:

[0042] According to the mass percentage, 10% of the brown corundum particles with a particle size of 2-3mm, 60% of the brown corundum particles with a particle size of 1-2mm and 30% of the brown corundum particles with a particle size of no more than 1mm are evenly mixed together and put into the electric furnace. To make the surface smooth, use an electric furnace to heat the brown corundum particles to 380°C and keep the temperature constant. Put the soldering side of the printed circuit board down on the heated brown fused alumina particles, and apply a vertical force to make it fully contact with the brown fused alumina particles. After heating for 3.5 minutes, the solder on the printed circuit board is completely melted, and the printed circuit board is taken out so that its soldering surface faces upwards and the component faces downwards, and the high-fr...

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Abstract

The invention discloses a method for separating elements and solder from a waste printed circuit board. The method is characterized by including: using brown fused alumina particles as heating media, and using a flat-bottom electric furnace for heating the brown fused alumina particles; and placing a welding surface of the printed circuit board downwards, flatly placing the printed circuit board on the heated brown fused alumina particles, applying vertical downward force to an element surface of the printed circuit board to enable the welding surface to be in full contact with the heated brown fused alumina particles, taking out the printed circuit board after the solder is molten completely, placing the welding surface upwards and the element surface downwards, applying vertical impact force to the welding surface, and enabling the solder and the elements to be separated from the printed circuit board. The method is low in energy consumption, low in cost, high in separating efficiency and good in separating effect.

Description

technical field [0001] The present invention relates to a method of separating components and solder from waste printed circuit boards. Background technique [0002] Printed circuit board, referred to as PCB, is an indispensable part of electronic and electrical products. With the rapid development of the electronics industry and the continuous application of high-tech, the number of eliminated electronic appliances has increased sharply, resulting in a large number of waste printed circuit boards, which will pose a serious threat to environmental protection if they are not properly recycled. Experimental testing shows that most of the components on the discarded printed circuit boards are functional and can still be used; at the same time, because electronic components contain various toxic and harmful substances and precious metals, before recycling the circuit boards, if they are The removal of the components can greatly simplify the subsequent recycling process, especia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/018
Inventor 王玉琳王庆阳高梦迪陈方秋刘光复
Owner HEFEI UNIV OF TECH
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