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Pressure-sensitive heat-resistant sealed microcapsule

A microcapsule and sensitive technology, applied in the preparation of microcapsules, adhesives, microspheres, etc., can solve the problems of low mechanical strength, complex production equipment, poor sealing of wall materials, etc., achieve high mechanical strength, excellent sealing, external pressure sensitive effect

Inactive Publication Date: 2015-04-01
NORTHWEST A & F UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the amine curing agent of epoxy resin has amphiphilicity and high activity, and it is very difficult to microencapsulate
In the past, people mostly used physical methods for microencapsulation, so the sealing performance of the wall material was poor, the mechanical strength was low, and the production equipment was complicated

Method used

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  • Pressure-sensitive heat-resistant sealed microcapsule
  • Pressure-sensitive heat-resistant sealed microcapsule

Examples

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Comparison scheme
Effect test

Embodiment 1

[0023] A pressure-sensitive heat-resistant sealed microcapsule, the microcapsule includes a core material and a wall material coated on the outside of the core material, the core material is ethylenediamine, and the wall material is epoxy resin E-51 reacted with ethylenediamine The resulting cured resin has a mass ratio of core material to wall material of 1:2. The preparation method is as follows:

[0024] 50g of epoxy resin E-51 and 2.5g of ethylenediamine, pre-polymerized at 50°C for 10min, then dissolved in 500ml of carbon tetrachloride, then 25g of ethylenediamine was added dropwise into the solution with a needle and kept at 50°C, The microcapsule wall is solidified and formed, filtered, washed and dried to obtain microcapsules.

Embodiment 2

[0026] Another pressure-sensitive heat-resistant sealed microcapsule, the microcapsule includes a core material and a wall material coated on the outside of the core material, the core material is tetraethylenepentamine, and the wall material is epoxy resin E-44, styrene oxide It is a cured resin produced by the reaction of SO and triethylenetetramine. The preparation method is as follows:

[0027] 40g of epoxy resin E-44, 10g of styrene oxide SO and 3.0g of triethylenetetramine, pre-polymerized at 50°C for 8min, then dissolved in 500ml of DBP, and then 22.5g of tetraethylenepentamine was added dropwise to the solution with a needle Keep at 50°C in the middle, filter, wash and dry to obtain microcapsules after the microcapsule walls solidify and form.

Embodiment 3

[0029]50g of epoxy resin E-51 and 4.5g of CAPCURE WR-6, pre-polymerized at 20°C for 12min, then dissolved in 500ml of xylene, then dripped CAPCURE WR-6, 32g into the solution with a needle and kept at 20°C, until The microcapsule wall is solidified and formed, filtered, washed and dried to obtain microcapsules.

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Abstract

The invention discloses a pressure-sensitive heat-resistant sealed microcapsule. A wall material of the microcapsule is a cured substance of epoxy resin and an amine curing agent, and a core material of the microcapsule is an epoxy resin amine curing agent with the viscosity of 1-25,000mPa.s at the temperature of 25 DEG C and the boiling temperature of 100-300 DEG C. The mass ratio of the core material to the wall material of the microcapsule is (1 to 5) to (5 to 1). The microcapsule is good in mechanical performance, sealing performance and heat resistance, naturally compatible with the epoxy resin and easily dispersible in the epoxy resin. The microcapsule as a 'micro-container' can be used in the field of self-repairing materials, latent adhesives or other core materials required to be subjected to controlled release or isolation.

Description

technical field [0001] The present invention relates to a microcapsule, in particular to a heat-resistant microcapsule which is sensitive to external pressure and has excellent airtightness. Background technique [0002] Thermosetting epoxy resin composites have excellent performance and are widely used. However, its curing process is often subject to various environmental conditions, and there are often contradictions between the pot life and the performance of the cured product, and the contradiction between the curing conditions and the performance of the cured product. Therefore, many latent curing agents have been developed to solve the contradiction between the pot life and the performance of the cured product to a certain extent. However, the contradiction between the curing conditions and the performance of the cured product is still very prominent. For example, in many construction or civil engineering, epoxy resin often needs to be constructed at a higher tempera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C08G59/66C08G59/44C08G59/40B01J13/14C09J163/00
Inventor 亢阳应珏应军朱建设翟洪金
Owner NORTHWEST A & F UNIV
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