Automatic position returning device for drawing die inner hole

Abstract

The invention discloses an automatic position returning device for a drawing die inner hole. A transition device is arranged on the basis of the existing drawing die measuring instrument, the transition device is controlled to perform transition according to positions of a drawing die inner hole imaged image in collected images of an image collector to drive a drawing die to perform transition or drive a microscope and the image collector to perform transition, so that an inner hole image is located at a field-of-view center for the image collector to perform image collection, the problem that the inner hole image exceeds the image collector field-of-view is solved, the problem that measuring value error exists due to different inner hole positions caused by the camera distortion is solved, the success rate, repetition and accuracy of the drawing die hole diameter measurement are improved, and the measuring efficiency is greatly improved in comparison with the existing artificial moved drawing die or the die placing platform.

Description

Technical field [0001] The invention belongs to the technical field of hole diameter measurement of a wire drawing die, and more specifically, relates to an automatic return device for the inner hole of a wire drawing die. Background technique [0002] With the rapid development of the communication industry in recent years, it has evolved from simple telephone and telegraph cables to combined communication cables. Such cables are usually small and uniform in size and require high manufacturing precision. The diameter and uniformity of the cable are determined by the wire drawing die. The wire drawing die is made of wear-resistant and high-temperature resistant materials. However, in the high-speed wire drawing process, the wire drawing die will inevitably be worn after a period of time. . The diameter and shape of the worn mold may change, which directly affects the quality of the production cable. Therefore, the inspection of the diameter and shape of the drawing die is part...

AI Technical Summary

Problems solved by technology

[0004] 1. The image collector and mold placement table of the aperture measuring instrument using the optical method can only be adjusted in the direction perpendicular to the mold plane. When measuring the diameter of the mold, the observation field of the image collector is small, and the inner hole of the mold has Eccentricity, deviation of the center of the mold placement table and the image collector, etc., may easily cause the hole to be measured to exceed the field of view of the image collector, and the measurement failure rate is high;

[0005] 2. When the aperture measuring instrument using the optical method measures the aperture of the wire drawing die, there are eccentricities in the inner hole of the wire drawing die, and there is a deviation in the center of the die placement table and the image collector. The actual measurement is often not in the center of the field of view. The existence of lens distortion leads to inconsistencies in the measurement values ​​of the same inner hole at different positions in the field of view of the image collector, resulting in low measurement repeatability and low accuracy

[0006] At present, when the aperture measuring instrument adopts the optical method, when the inner hole to be measured deviates greatly from the center of the image collector or exceeds the field of view, it can only manually move the wire drawing die or the mold placement table, and manually search for the inner hole to return to the center of the field of view. The center of the field of view of the image collector, which will lead to long operation time and low efficiency; and the accuracy of manually moving the drawing die or mold placement table is very low, and it is difficult to ensure that it can be moved to the center of the field of view of the image collector

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