Components for modular automation
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SIEMENS AG
- Publication Date
- 2016-02-17
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to an assembly for a modularized automation device, in which an SMD circuit board is arranged parallel to the side wall of the housing encapsulation cover of the assembly, and the SMD circuit board has a function for detecting The temperature of the incoming air in the encapsulation, where the incoming air flows through the SMD circuit board through the air inlet of the housing encapsulation and finally through the air outlet of the housing encapsulation. Furthermore, the invention relates to a circuit board for such an assembly. Background technique
[0002] Such an assembly is known from the 2011 edition of the Siemens Product Catalog, Chapter 5, page 70. Such assemblies, which can be mounted on a carrier, are part of a modular automation system and each have an SMD circuit board inside the housing encapsulation, which SMD circuit board is provided with electrical and electronic components. The removal of heat from suc...