Method for manufacturing high-density large-scale micro-nano-structure array
A micro-nano structure, high-density technology, applied in the direction of cells, electrolytic processes, electrolytic components, etc., can solve problems such as low efficiency and yield, technical and cost problems, achieve manufacturing difficulty and cost reduction, improve manufacturing efficiency, expand The effect of material complexity and functional diversity
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Embodiment 1
[0023] Manufacture a high-density large-scale micro-nano structure array composed of (n×N)×(m×M) micro-nano structures, the N and M are both integers between 3-500, and the n and m are both 1 Integers between -100, the N is the number of micro-electrolysis catheters arranged horizontally in the micro-electrolysis catheter array, and the M is the number of vertically-arranged micro-electrolysis catheters in the micro-electrolysis catheter array; the high-density large-scale micro-nano In the structure array, the spacing between adjacent micro-nano structures in the horizontal row is d1, and the spacing between adjacent micro-nano structures in the vertical row is d2, and the dimensions of d1 and d2 are 5nm-20μm:
[0024] 1) combine Figure 1-Figure 5 , providing a mounting substrate 2 with a rectangular array of plane mounting holes, the number of plane mounting holes 3 in the rectangular array of plane mounting holes is equal to N×M, and in the rectangular array of plane mount...
Embodiment 2
[0027] Manufacture a high-density large-scale rectangular array of columnar micro-nano structures consisting of (3×3)×(1×3) columnar micro-nano structures, where the spacing between adjacent columnar micro-nano structures in the vertical row is 2 μm, and the adjacent columnar micro-nano structures in the horizontal row The pitch of the columnar micro-nano structure is 1 μm:
[0028] 1) combine Figure 1-Figure 5 , providing a mounting substrate 2 with a rectangular array of planar mounting holes, the number of planar mounting holes 3 in the rectangular array of planar mounting holes is equal to 3×3 (that is, 9), wherein the spacing between adjacent mounting holes 3 in a vertical row Set to 2 μm, the distance between adjacent mounting holes 3 in the horizontal row is set to 3 μm, the thickness of the mounting substrate 2 is 350 μm, and the mounting substrate 2 is prepared by the micro-electromechanical system (MEMS) processing method of the prior art , providing 3×3 microelect...
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