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Polyhedron main substrate, manufacturing method and processing method thereof

A manufacturing method and the technology of the main substrate, applied in the exposure device, installation, optics and other directions of the photolithography process, can solve the problems of excessive quality, difficult processability, long delivery time, etc., and achieve good dynamic performance and stability, The overall structure is compact and efficient

Active Publication Date: 2013-09-25
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

[0007] The present invention aims to provide a polyhedral main substrate structure aimed at the defects of the existing photolithography machine main substrate, such as high manufacturing cost, difficult processability, long delivery period, poor dynamic performance, and excessive quality.

Method used

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  • Polyhedron main substrate, manufacturing method and processing method thereof
  • Polyhedron main substrate, manufacturing method and processing method thereof
  • Polyhedron main substrate, manufacturing method and processing method thereof

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Embodiment Construction

[0041] In order to illustrate the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0042]The polyhedral main substrate of the present invention is used for installing the supporting device, the measuring device and the lens barrel device, and at least one station is provided on the main substrate. Wherein, the outer surface of the main substrate is defined by the polygonal enveloping surface of the installation area of ​​the supporting device, the measuring device, and the lens barrel device, and is a convex polyhedron formed by connecting several other planes according to convex hull rules. In a specific implementation manner, the enumeration that the polyhedral main substrate is a double-station main substrate should not be considered as a limitation of the present invention.

[0043] see figure 1 , figure 2 , fi...

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Abstract

The invention relates to a polyhedron main substrate for installing support devices, a measurement device and a lens barrel device, wherein the main substrate is provided with at least a working position, and the outer surface of the main substrate is defined by polygon enveloping surfaces of installation regions of the support devices, the measurement device and the lens barrel device, and is a convex polyhedron formed through connecting a plurality of other planes according to a convex enveloping rule. According to the present invention, based on the polyhedron structure design, the whole structure of the obtained main substrate is simple and efficient, good dynamic performance and good stability can be achieved, processing characteristics of integrated main substrate casting are met, and the main substrate formed through the combination has performance advantages of high modality and low quality compared with the existing structure.

Description

technical field [0001] The invention relates to semiconductor manufacturing equipment, in particular to a polyhedral main substrate structure used in photolithography equipment and its manufacturing method and processing method. Background technique [0002] The main substrate and the measurement bracket are the core of the frame design of the lithography machine. It not only needs to have high-mode characteristic indicators to meet the needs of short-term stability and dynamic performance, but also must find a very good solution in the field of materials and heat transfer. A good balance point to meet the needs of long-term thermal stability. In addition, with the increase in the quality of the objective lens and measurement system, the design of the main substrate and measurement bracket is forced to meet the development trend of low quality and light weight. Therefore, the design direction of the main substrate and the measurement bracket needs to have the dual character...

Claims

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Application Information

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IPC IPC(8): G03F7/20G02B7/00
Inventor 吴飞王茜魏巍袁志扬陈文枢
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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