Image sensor packaging method and structure, image sensor module and forming method

Abstract

The invention provides a method and structure of image sensor packaging, an image sensor module and a forming method of the image sensor module. The structure of image sensor packaging comprises an image sensor chip and a lead board fixedly connected with the image sensor chip. A functional face of the image sensor chip is provided with a light-sensing zone and a non-light-sensing zone. The light-sensing zone is provided with a pixel unit. The non-light-sensing zone is provided with a first electrode. Protective glue is arranged at the side face of the image sensor chip. The lead board is provided with a frame board and an internally arranged wire penetrating through the thickness of the frame board. An opening is formed in the frame board. The light-sensing zone is exposed through the opening. One end of the internally arranged wire is electrically connected with the first electrode. In the structure of the image sensor packaging, the excellent rate of each part can be controlled independently, therefore, reliability is high, and meanwhile, the heat dissipating performance is good, and the structure of image sensor packaging is ultrathin.

Description

technical field [0001] The invention relates to the field of image sensors, and is characterized in that it relates to an image sensor packaging method and structure, an image sensor module and a forming method. Background technique [0002] An image sensor is a semiconductor device device that converts optical information into electrical signals. Existing image sensors can be further classified into complementary metal oxide semiconductor (CMOS) image sensors and charge coupled device (CCD) image sensors. [0003] With the trend of miniaturization and multi-function in the semiconductor industry and market competition, the new generation of electronic products has higher requirements for image sensors, such as smaller shape and lower cost. However, traditional image sensor packaging methods usually lead the pads on the functional surface of the image sensor to the back, and then make conductive solder balls or pins on the back, so that the obtained image sensor packaging s...

AI Technical Summary

Problems solved by technology

[0005] 1. The existing image sensor packaging method needs to fabricate the back-side lead-out structure on the image sensor, that is, the back-side lead-out structure cannot be separated from the image sensor and must be fabricated separately first, so the yield rate of the back-side lead-out structure is not easy to control independently, and the back-side lead-out structure cannot be separated from the image sensor. The manufacturing yield of the structure is not high, resulting in low packaging process yield

[0006] 2. In addition to setting the rear lead-out structure in the existing image sensor packaging method, it is also necessary to set a protective substrate on the functional surface of the image sensor for protection. In this way, the functional surface and the back of the image sensor need to be increased to a certain thickness, so the image sensor cannot be integrated. The packaging structure is made thinner

[0007] 3. When setting the back lead-out structure for the image sensor, it is necessary to set an insulating layer and a protective layer on the back to protect the corresponding wires. However, the setting of these wires, insulating layers or protective layers not only increases the complexity of the image sensor package and process cost, and reduces the heat dissipation performance of the formed image sensor package structure

[0010] For this reason, there is an urgent need for an image sensor packaging method and packaging structure, as well as an image sensor module and its forming method, to solve the problems of complex process and high process cost of the existing image sensor packaging method, and the thickness of the existing image sensor packaging structure is large and The problem of poor heat dissipation performance, the problem of complex process and high process cost of the existing image sensor module formation method, and the problem of large thickness and poor heat dissipation performance of the existing image sensor module

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