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Tapered bump structure

A technology of oblique cones and bumps, which can be used in electrical components, electric solid state devices, circuits, etc., and can solve problems such as inconvenience

Active Publication Date: 2015-08-19
CHIPBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This shows that above-mentioned existing technology obviously still has inconvenience and defect in structure and use, and urgently needs to be further improved

Method used

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Embodiment Construction

[0050] In order to further explain the technical means and effects that the present invention adopts to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation, structure, characteristics and details of the tapered bump structure proposed according to the present invention Its effect is described in detail below.

[0051] see Figure 4 , which is a tapered bump structure 100 of the present invention, which is arranged on a carrier 200, the carrier 200 has a plurality of solder pads 210 and a protective layer 220, the protective layer has a plurality of openings 221, and the opening 221 The above-mentioned pad 210 is exposed, and the tapered bump structure 100 is electrically connected to the pad 210. The tapered bump structure 100 at least includes a conductive block 110 and a tapered insulating layer 120. The conductive block 110 has a side surface 111 and a top surface 112, the...

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Abstract

The invention relates to an oblique-conic-shaped bump structure, which is arranged on a carrier. The carrier is provided with a plurality of bonding pads and a protection layer, the protection layer is provided with a plurality of openings, and the bonding pads are exposed out of the openings. The oblique-conic-shaped bump structure comprises a conducting block and an oblique-conic-shaped insulation layer, the conducting block is arranged on the bonding pads of the carrier, the side of the conducting block is coated with the oblique-conic-shaped insulation layer, the oblique-conic-shaped insulation layer is provided with a bottom close to the carrier and a top positioned above the bottom, and the external diameter of the oblique-conic-shaped insulation layer tapers from the bottom to the top. When the carrier is pressed on a substrate and an anisotropic conductive adhesive arranged on the substrate, the oblique-conic-shaped bump structure can be inserted into the anisotropic conductive adhesive quickly so as to improve the flow efficiency of the anisotropic conductive adhesive, avoid short circuit of adjacent bumps, and improve yield of sealing technologies.

Description

technical field [0001] The present invention relates to an oblique cone-shaped bump structure, in particular to a structure that can increase the flow efficiency of anisotropic conductive adhesive in the press-fit packaging process and avoid short-circuiting of adjacent bumps to improve the packaging process. Rate of oblique cone-shaped bump structure. Background technique [0002] Electronic products must meet the requirements of high-speed processing, multi-functionality, integration, miniaturization, light weight, and low price. Therefore, integrated circuit packaging technology is also developing towards miniaturization and high density. Commonly used packaging technologies include Ball Grid Array (BGA), Chip-Scale Package (CSP), Flip Chip (F / C), Multi-Chip Module (Multi-Chip Module, MCM) and so on. [0003] see figure 1 In the existing conventional flip-chip packaging technology, a plurality of bonding pads 11 (bonding pads) of a chip 10 are arranged on an active sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L23/488H01L21/60
CPCH01L2224/83192H01L2224/32225H01L2924/15788H01L2224/73204H01L2224/16225H01L2924/07811H01L24/11H01L2224/11H01L2924/14H01L2924/00H01L2924/00012
Inventor 巫志弘何荣华郭志明施政宏邱奕钏
Owner CHIPBOND TECH
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