Image sensor packaging method and structure, image sensor module and forming method

Abstract

The invention provides an image sensor packaging method, an image sensor packaging structure, an image sensor module and an image sensor module forming method. The image sensor packaging structure comprises an image sensor and a lead board fixedly connected with the image sensor, a functional face of the image sensor is provided with a light-sensing area and a non-light-sensing area, pixel units are arranged in the light-sensing area, first electrodes are arranged in the non-light-sensing area, the lead board is provided with a frame board and a built-in guide wires penetrating the thickness of the frame board, the frame board is provided with openings which are exposed in the light-sensing area, and one end of each built-in guide wire is connected with one first electrode. In the image sensor packaging structure, every part is manufactured independently and then packaged together, so that yield of every part can be controlled independently, and the image sensor packaging structure is high in reliability, good in heat radiation and extremely thin.

Description

technical field [0001] The invention relates to the field of image sensors, and is characterized in that it relates to an image sensor packaging method and structure, an image sensor module and a forming method. Background technique [0002] An image sensor is a semiconductor device device that converts optical information into electrical signals. Existing image sensors can be further classified into complementary metal oxide semiconductor (CMOS) image sensors and charge coupled device (CCD) image sensors. [0003] Image sensors are developing toward miniaturization, and the new generation of electronic products has higher requirements for image sensor packaging structures, such as smaller shape and lower cost. However, traditional image sensor packaging methods usually lead the pads on the functional surface of the image sensor to the back, and then make conductive solder balls or pins on the back, so that the obtained image sensor packaging structure can be connected to e...

AI Technical Summary

Problems solved by technology

[0004] 1. The existing image sensor packaging method needs to fabricate the back-side lead-out structure on the image sensor, that is, the back-side lead-out structure cannot be separated from the image sensor and must be fabricated separately first, so the yield rate of the back-side lead-out structure is not easy to control independently, and the back-side lead-out structure cannot be separated from the image sensor. The manufacturing yield of the structure is not high, resulting in low packaging process yield;

[0005] 2. In addition to setting the rear lead-out structure in the existing image sensor packaging method, it is also necessary to set a protective substrate on the functional surface of the image sensor for protection. In this way, the functional surface and the back of the image sensor need to be increased to a certain thickness, so the image sensor cannot be integrated. The packaging structure is made thinner;

[0006] 3. When setting the back lead-out structure for the image sensor, it is necessary to set an insulating layer and a protective layer on the back to protect the corresponding wires. However, the setting of these wires, insulating layers or protective layers not only increases the complexity of the image sensor package and process cost, and reduces the heat dissipation performance of the formed image sensor package structure

[0009] For this reason, there is an urgent need for a packaging method and packaging structure of an image sensor, as well as an image sensor module and its forming method, to solve the problems of complex process and high process cost of the existing image sensor packaging method, and the thickness of the existing image sensor packaging structure The problem of large and poor heat dissipation performance, the problem of complex process and high process cost of the existing image sensor module formation method, and the problem of large thickness and poor heat dissipation performance of the existing image sensor module

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