Manufacturing method of buried inductance printed circuit board and circuit board prepared by the method
A technology of printed circuit board and manufacturing method, which is applied to printed circuits connected with non-printed electrical components, and assembling printed circuits with electrical components, etc. problems, to achieve the effect of improving production efficiency, simplifying the production process, and improving resin uniformity
Active Publication Date: 2015-12-02
DONGGUAN SHENGYI ELECTRONICS
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Problems solved by technology
In this manufacturing method, resin extrusion under high temperature and high pressure during the embedding process of the magnetic core will lead to a decrease in inductance, and the process of milling accommodating slots in the core board, resin plugging, curing, and grinding boards is required, and the manufacturing process is complicated and tedious. , which is not conducive to the mass production and operation of PCB manufacturers; in addition, the filling resin around the magnetic core is prone to voids, and its uniformity and regularity are not good
Method used
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[0020] In order to explain in detail the technical solutions adopted by the present invention to achieve the intended technical purpose, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described implementation Examples are only part of the embodiments of the present invention, rather than all embodiments, and, on the premise of not paying creative work, the technical means or technical features in the embodiments of the present invention can be replaced, the following will refer to the accompanying drawings and combine Examples illustrate the present invention in detail.
[0021] see image 3 , the embedded inductance printed circuit board shown in the preferred embodiment of the present invention includes a core board 10 and prepregs 20 formed on the upper and lower sides of the core board 10 . The core p...
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The invention provides a method for manufacturing an inductor-buried type printed circuit board and the circuit board manufactured through the method. The method for manufacturing the inductor-buried type printed circuit board comprises the following steps: step 1, a magnetic core is provided and wrapped in a resin material in an injection moulding mode; step 2, a circuit board body and prepreg are provided, an accommodating groove is formed in the circuit board body, the resin material wrapping the magnetic core is placed in the accommodating groove, and the circuit board body and the prepreg are stacked in a press fit mode. The method for manufacturing the inductor-buried type printed circuit board simplifies the technological processes of manufacturing a magnetic core-buried PCB and improves production efficiency; in addition, the magnetic core is wrapped by the resin material before the press fit, so that the situation that the performance of the magnetic core is affected by the extrusion of resin at a high temperature and high pressure in the press fit process is avoided; the surface of the magnetic core is wrapped by the resin material in the injection moulding mode, and therefore the uniformity and orderliness of the resin surrounding the magnetic core can be improved to guarantee that the periphery of the magnetic core is filled with the resin and is free of cavities.
Description
technical field [0001] The invention relates to printed circuit board technology, in particular to a method for manufacturing a buried inductance type printed circuit board and a circuit board prepared by the method. Background technique [0002] With the rapid development of the IT industry, in order to realize the requirements of high density, miniaturization and multi-function of PCB, buried inductance printed circuit board came into being. The usual production method of the existing buried inductance printed circuit board is to open a storage slot on the core board, put the magnetic core into the storage slot and fill it with resin to cure, and then press the core board with the prepreg (made of resin) combine. In this manufacturing method, resin extrusion under high temperature and high pressure during the embedding process of the magnetic core will lead to a decrease in inductance, and the process of milling accommodating slots in the core board, resin plugging, curin...
Claims
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IPC IPC(8): H05K3/30H05K1/18
Inventor 陶伟纪成光肖璐李民善杜红兵
Owner DONGGUAN SHENGYI ELECTRONICS