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a lead frame

A lead frame and frame technology, used in electrical components, electrical solid devices, circuits, etc., can solve problems such as easy deformation under force, and achieve the effect of preventing deformation under force

Active Publication Date: 2016-09-14
吉林华微斯帕克电气有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the aforementioned technical problem that the protruding structure on the existing lead frame is easily deformed by force when the packages are stacked, the present invention provides a lead frame

Method used

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Embodiment Construction

[0020] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] In the description of the present invention, it should be noted that unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; for Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

[0022] The embodiment of the present invention provides a lead frame 1, the three-dimensional structure of the lead frame 1 is as follows figure 2 shown. Th...

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Abstract

Aiming at solving the technical problem that convex structures of conventional leading wire frameworks are easily deformed by force, the invention provides a leading wire framework. The leading wire framework comprises a substrate, and at least one convex structure protruding from the surface of the substrate. The substrate comprises a part zone and a resectable zone. The resection zone is located at the periphery of the part zone. The convex structure is arranged in the part zone. The resectable zone is also provided with a supporting member. The height of the supporting member is greater than the heights of the convex structures. The leading wire provided by the invention can prevent the convex structures from deforming under force.

Description

technical field [0001] The invention relates to the field of semiconductor chip packaging, in particular to a lead frame used in the semiconductor chip packaging process. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that uses bonding materials (gold wire, aluminum wire, copper wire) to realize the electrical connection between the lead-out end of the chip's internal circuit and the outer lead to form an electrical circuit. As a bridge to connect with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] A type of lead frame is currently provided, and the lead frame is mainly used to carry power chips. Since the power chip is usually equipped with a drive circuit, the drive circuit is usually welded on a PCB (Printed Circuit Board, printed circuit board) board. and fix it on the lead frame. like ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495
CPCH01L2924/0002
Inventor 陈鋆张礼振刘杰
Owner 吉林华微斯帕克电气有限公司
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