Adhesive sheet for semiconductor device manufacturing, semiconductor device, and manufacturing method thereof
A manufacturing method and semiconductor technology, which can be used in semiconductor/solid-state device manufacturing, semiconductor devices, adhesives, etc., can solve the problems of strong bonding strength and difficult peeling of sealing resin, and achieve the effect of good peelability
Active Publication Date: 2015-12-23
TOMOEGAWA PAPER CO LTD
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Problems solved by technology
[0009] However, in the invention of Patent Document 1, although the problem of adhesive transfer can be reduced, there is a problem that the adhesive strength to the sealing resin is strong and it is difficult to peel off.
Method used
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Embodiment 1～3、 comparative example 1～4）
[0113] According to the composition shown in Table 1, each raw material was dispersed in an appropriate amount of toluene, and a binder coating liquid was prepared respectively. TUF-TECHM-1943 was dissolved in toluene.
[0114] Then, a polyimide resin film (manufactured by DuPont Toray, trade name: kapton100EN, thickness 25 μm, glass transition temperature 300° C. or higher, thermal expansion coefficient 16 ppm / ° C.) was prepared as a heat-resistant base material. On this heat-resistant base material, the above-mentioned adhesive coating solution was coated to a thickness of 5 μm after drying. After applying the adhesive coating liquid, it was dried at 150° C. for 3 minutes to obtain the adhesive sheet of each example. For the obtained adhesive sheet, the surface fluorine content and adhesive strength were measured. Also, the occurrence of mold flashing and sticky transfer was evaluated. In addition, the size of the adhesive sheet was 60 mm in length and 50 mm in width.
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Abstract
The present invention relates to an adhesive sheet for manufacturing a semiconductor device, a semiconductor device, and a method for manufacturing the semiconductor device. The adhesive sheet for manufacturing a semiconductor device includes a substrate and an adhesive layer provided on one side of the substrate and containing a fluorine-containing additive, and is attached to a lead frame (20) or a wiring substrate of a semiconductor device in a peelable manner. Above, the adhesive sheet (10) for manufacturing semiconductor devices is characterized in that the surface fluorine recovery rate of the adhesive layer calculated according to the following formula (I) is 70% or more: Surface fluorine recovery rate (% ) = surface fluorine content after restoration α ÷ initial surface fluorine content β × 100? ? ? ...(I).
Description
[0001] Cross References to Related Applications [0002] This application is based on and claims the benefit of priority from Japanese Patent Application Japanese Patent Application No. 2012-70403 filed on March 26, 2012, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to an adhesive sheet for manufacturing a semiconductor device and a method for manufacturing a semiconductor device. Background technique [0004] In recent years, along with miniaturization and multifunctionalization of electronic equipment such as portable personal computers and mobile phones, high-density mounting technology for electronic components is required in addition to miniaturization and high integration of electronic components constituting the electronic equipment. In this case, surface-mount semiconductor devices such as CSP (Chip Scale Package: Chip Size Package) that can be mounted in high density replace peripheral moun...
Claims
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IPC IPC(8): C09J7/02C09J11/06H01L21/603
CPCH01L24/97H01L2224/45144H01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012C09J7/22C09J7/30C09J7/35C09J2203/326C09J2301/304C09J2301/312C09J2301/40C09J2301/50
Inventor 町井悟山井敦史春日英昌
Owner TOMOEGAWA PAPER CO LTD