Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An automatic positioning method for installing package heat dissipation cover

A technology of automatic positioning and heat dissipation cover, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inaccurate alignment, and achieve the effects of avoiding poor stability, stable bonding process, and improved pass rate

Active Publication Date: 2015-11-18
JIANGNAN INST OF COMPUTING TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for automatic positioning of the mold to ensure the precise alignment of the substrate and the heat dissipation cover during the above assembly process, aiming at the defect that the package heat dissipation cover cannot be accurately aligned during the assembly process of the prior art. How to Install Package Heat Sink Cover

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An automatic positioning method for installing package heat dissipation cover
  • An automatic positioning method for installing package heat dissipation cover
  • An automatic positioning method for installing package heat dissipation cover

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0030] The invention makes the process of installing the heat dissipation cover controllable through the independent mold design, completes the combination of the heat dissipation cover and the substrate on which the silicon chip has been installed, and makes it a packaged integral device.

[0031] Figure 4 A flow chart of an automatic positioning method for installing a package heat dissipation cover according to a preferred embodiment of the present invention is schematically shown.

[0032] Such as Figure 4 As shown, the automatic positioning method for installing the package heat dissipation cover according to the preferred embodiment of the present invention includes:

[0033] The first step S01: manufacturing the cooling cover position...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an automatic positioning method for mounting and packaging a radiating cover. The method comprises the steps of manufacturing a radiating cover positioning mould, wherein the radiating cover positioning mould comprises a panel with a hollow area, and an edge clamping spring is formed by cutting two connected sides of the hollow area into grooves; manufacturing a substrate positioning mould, wherein the substrate positioning mould comprises a panel with a hollow area, and an edge clamping spring is formed by cutting two connected sides of the hollow area into grooves; directly bonding the substrate positioning mould and the radiating cover positioning mould through bonding glue and fixing the opposite position, wherein at the position, a substrate inlaid in the substrate positioning mould and a radiating cover inlaid in the radiating cover positioning mould mutually coincide without deflection; inverting the radiating cover in the hollow area of the radiating cover positioning mould, and fixing the radiating cover on the radiating cover positioning mould through the edge clamping springs at the side edges; and inverting the substrate which is coated with binder and heat conduction silicone grease and is provided with a bare chip in the hollow area of the substrate positioning mould.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, and more specifically, the invention relates to an automatic positioning method for installing a package heat dissipation cover. Background technique [0002] In the packaging process, flip chip is equivalent to a fully packaged chip, which is directly connected to the packaging substrate pad by the solder ball of the bare silicon chip, and provides the internal connection structure of the next level of packaging. As a whole, when the die is in normal operation, it needs to remove the heat generated inside in time (for example, because the CPU die has a large working heat, so the heat must be exported in time), so as to ensure the reliable and normal operation of the chip. Among them, adding a copper-nickel alloy heat dissipation cover is an option to remove heat. A common heat dissipation method is to install a heat dissipation cover on the backside of the die. [0003] For the insta...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68
Inventor 吴小龙陈文录刘晓阳王彦桥孙忠新高锋朱敏梁少文
Owner JIANGNAN INST OF COMPUTING TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com