An automatic positioning method for installing package heat dissipation cover

Abstract

The invention discloses an automatic positioning method for mounting and packaging a radiating cover. The method comprises the steps of manufacturing a radiating cover positioning mould, wherein the radiating cover positioning mould comprises a panel with a hollow area, and an edge clamping spring is formed by cutting two connected sides of the hollow area into grooves; manufacturing a substrate positioning mould, wherein the substrate positioning mould comprises a panel with a hollow area, and an edge clamping spring is formed by cutting two connected sides of the hollow area into grooves; directly bonding the substrate positioning mould and the radiating cover positioning mould through bonding glue and fixing the opposite position, wherein at the position, a substrate inlaid in the substrate positioning mould and a radiating cover inlaid in the radiating cover positioning mould mutually coincide without deflection; inverting the radiating cover in the hollow area of the radiating cover positioning mould, and fixing the radiating cover on the radiating cover positioning mould through the edge clamping springs at the side edges; and inverting the substrate which is coated with binder and heat conduction silicone grease and is provided with a bare chip in the hollow area of the substrate positioning mould.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, and more specifically, the invention relates to an automatic positioning method for installing a package heat dissipation cover. Background technique [0002] In the packaging process, flip chip is equivalent to a fully packaged chip, which is directly connected to the packaging substrate pad by the solder ball of the bare silicon chip, and provides the internal connection structure of the next level of packaging. As a whole, when the die is in normal operation, it needs to remove the heat generated inside in time (for example, because the CPU die has a large working heat, so the heat must be exported in time), so as to ensure the reliable and normal operation of the chip. Among them, adding a copper-nickel alloy heat dissipation cover is an option to remove heat. A common heat dissipation method is to install a heat dissipation cover on the backside of the die. [0003] For the insta...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for automatic positioning of the mold to ensure the precise alignment of the substrate and the heat dissipation cover during the above assembly process, aiming at the defect that the package heat dissipation cover cannot be accurately aligned during the assembly process of the prior art. How to Install Package Heat Sink Cover

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