Intelligent transporting-and-packaging-box monitoring micro system

A technology for intelligent monitoring and packaging, applied in packaging and other directions, can solve the problem of not releasing product information, and achieve the effects of low power consumption, convenient installation and perfect functions

Inactive Publication Date: 2013-10-30
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Abstract
  • Description
  • Claims
  • Application Information

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  • Intelligent transporting-and-packaging-box monitoring micro system
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  • Intelligent transporting-and-packaging-box monitoring micro system

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Embodiment Construction

[0020] The present invention (such as figure 1 Shown) The hardware structure consists of two parts: 1 main control circuit and 2 shells, such as figure 1 shown.

[0021] 1. The main control circuit includes 11 system control module, 12 status monitoring module, 13 data transmission module, 14 storage memory module, 15 satellite positioning module (optional), 16 abnormal alarm module (optional) and 17 power supply module. ,like figure 2 shown. 12 The system control module includes C8051F120 single-chip microcomputer and peripheral circuits to realize data processing and generate system instructions; 12 The state monitoring module integrates 21SHT10 temperature and humidity sensor, 22ADXL345 three-axis acceleration sensor, 23L3G4200D angular acceleration monitoring circuit, 24 Visible light monitoring circuit and 25 The time chip realizes the temperature and humidity ( image 3 ),speed( Figure 4 ), attitude inclination ( Figure 5 ), monitoring of visible light intensity...

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Abstract

The invention discloses an intelligent monitoring micro system used for monitoring and recording states of packaging boxes. The system is composed seven portions including a system control module, a state monitoring module, a data transmission module, a storing and memorizing module, a satellite positioning module (optional), an abnormity alarming module (optional) and a power source module. The system adopts the multi-sensor data fusion technology, so that real-time monitoring of various states is realized; the MEMS (micro-electromechanical system) technology is used, so that minimization and low power consumption of the system are realized. Functions of various instruments like vehicle GPS (global positioning system) positioning equipment, a traveling state recorder and an electronic door seal are realized in the micro system, and the micro system can be conveniently mounted inside various transporting and packaging boxes to perform detecting, recording, abnormity alarming and data transmitting on various states, like temperature and humidity, impact and vibration, posture and inclination angle and illegal opening, of the transporting and packaging boxes. The intelligent transporting-and-packaging-box monitoring micro system can realize whole-process monitoring of the packaging boxes filled with high-value, high-precision and easy-to-damage goods like high-price commodities, cultural relics and precision equipment.

Description

Technical field: [0001] The invention belongs to the field of integration and application of intelligent systems. The invention uses multi-signal data fusion technology and MEMS technology to realize the detection, recording, abnormal alarm and data transmission of various states such as temperature and humidity, impact vibration, attitude angle and illegal opening of the transport packaging box Background technique: [0002] The logistics industry is developing rapidly in my country, bringing great convenience to people's lives, but at the same time, there are also phenomena such as damage, replacement, and loss of goods. In addition, some special items have strict requirements on the stability of the transportation process, and large changes in the temperature and humidity of the impact vibration machine may cause damage to the function of the item. After the item is damaged, lost, or fails to function during transportation, it is necessary to restore the accident situati...

Claims

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Application Information

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IPC IPC(8): B65D79/02
Inventor 郭明儒娄文忠付悦洪荣森刘艳坤
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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