Method of producing a copper precursor and a copper precursor produced by using the same
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Publication Date
- 2013-10-30
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
[0001] Cross References to Related Applications
[0002] This application claims priority from Korean Patent Application No. 10-2012-0041519 filed with the Korean Intellectual Property Office on Apr. 20, 2012, the entire contents of which are hereby incorporated by reference into this application. technical field
[0003] The present invention relates to a copper precursor (copper precursor) and its preparation method, and more specifically, to a copper precursor preparation method and the copper precursor prepared by this method. The method does not need to generate intermediate Copper precursors can be prepared from intermediates, and copper precursors can be synthesized at low temperatures. Background technique
[0004] Since copper (Cu) has the same level of specific resistance as silver (Ag), and has a low cost of about one percent of silver (Ag), it is currently used as wires for most electronic components.
[0005] Copper (Cu) is mostly used in the form of powder in ...