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Double-substrate device and double substrate gluing method

A substrate and lamination technology, which is applied in lamination devices, chemical instruments and methods, optics, etc., can solve the problems of high instability, great influence, and difficulty in spitting out the nozzle head diameter rubber material, so as to improve the separation strength, Improved Instability and Uniformity

Inactive Publication Date: 2013-10-30
WINTEK CHINA TECH LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thinning of the substrate and the narrowing of the frame have a great impact on the reliability of the dual-substrate device, that is, the separation strength of the substrate
As the width of the frame glue required at present is getting thinner and thinner, the current coating nozzle head diameter can no longer meet the demand. In addition, if the separation strength of the substrate is to be improved, the viscosity of the glue material is bound to increase. Coating the frame glue with glue will cause disconnection and some gourd glue formation, and the traditional glue dispensing method is highly unstable, and the diameter of the nozzle head is also easily affected by dirt and dust, making it difficult to spit out the glue material

Method used

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  • Double-substrate device and double substrate gluing method
  • Double-substrate device and double substrate gluing method

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Embodiment Construction

[0044] Please refer to Figure 1 to Figure 5 , figure 1 It is a flowchart of a double-substrate bonding method according to an embodiment of the present invention, figure 2 is a schematic diagram of the screen 1 used in the screen printing process, image 3 is a schematic diagram of the first substrate 30 coated with the first sealant 34, Figure 4 It is a schematic diagram of bonding the second substrate 32 and the first substrate 30 coated with the first sealant 34 to form the double substrate device 3, Figure 5 yes Figure 4 The cross-sectional view of the double-substrate device 3 along the line X-X in .

[0045] First, step S10 is performed to provide a screen plate 1, wherein a first pattern 10 is pre-formed on the screen plate 1, and the first pattern 10 has at least two different widths W1, W2, such as figure 2 shown. In this embodiment, the first pattern 10 is square, wherein the width of the three sides 100 , 102 , 104 is W1 , and the width of the other side...

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Abstract

The invention discloses a double-substrate device comprising a first substrate, a second substrate and first frame glue. The first frame glue is located between the first substrate and the second substrate and surrounds the first substrate and the second substrate. The first frame glue has at least two widths, thus separation strength of the double-substrate device is higher. The double-substrate device has the advantages that the width of the frame glue can be increased only for the local part of the frame glue, needing higher separation strength, and accordingly the double-substrate device is more suitable for thinning design.

Description

technical field [0001] The present invention relates to a double-substrate device and a double-substrate lamination method, in particular to a double-substrate lamination method for forming frame glues with at least two different widths by a screen printing process and the double-substrate lamination method. dual substrate device. Background technique [0002] Based on the trend that the size of the current electronic products is gradually becoming thinner and smaller, the substrates of the display panels, touch panels and other dual-substrate devices mounted on the electronic products are getting thinner and thinner. In order to improve the resolution of the double-substrate device and expand the viewing area of ​​the double-substrate device to enhance the visual effect, the frame of the double-substrate device will become narrower and narrower. However, the thinning of the substrate and the narrowing of the bezel have a great impact on the reliability of the dual-substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333G02F1/1339B32B37/12
Inventor 陈昱廷陈韵婷
Owner WINTEK CHINA TECH LTD
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