255results about How to "Suitable design" patented technology

The present invention relates to an endoscope, more specifically to an endoscope that provides both forward view and rear view of a hollow body organ. It comprises of a rear view module that contains a rear image lens and a rear illumination bulb. The rear view module is designed and is attached to a conventional endoscope in a way that when deployed, the rear image lens and the rear illumination bulb face backward. In this position, the rear image lens provides a rear view and the rear illumination bulb illuminates the area under view of the rear image lens. The present invention enables the operator to obtain forward and rear views of a hollow organ either separately or simultaneously. The ability to obtain forward and rear view at the same time enables the operator to perform a complete examination of a hollow organ that includes both forward and rear view in a single insertion.The present invention enables surgical procedures to be performed in areas that are otherwise inaccessible and out of view of conventional endoscopes. This is made possible by a rear instrument channel located proximal to the rear view module. The present invention also improves distension and visualization of a hollow internal organ by having a rear air / water channel also located proximal to the rear view module. The present invention widens the field of vision of conventional endoscopes by enabling the addition of more than one forward image lens and more than one forward illumination bulb.

A semiconductor chip package mainly includes a semiconductor chip, a first dielectric layer disposed on the semiconductor chip, a plurality of conductive traces electrically connected to the semiconductor chip, a second dielectric layer disposed on the conductive traces and the first dielectric layer wherein a portion of the conductive traces are exposed from the second dielectric layer, and a plurality of contacts for external connection formed on the exposed portion of the conductive traces. The semiconductor chip has a surface including an active area, a dummy area surrounding the active area, and a plurality of bonding pads disposed on the active area. The bonding pads are electrically connected to the contacts by the conductive traces. The present invention further provides methods for manufacturing the semiconductor chip package.

Multi-stage transmission comprising four gear sets, shafts and shift elements. Sun of first set is connected to eighth shaft connected to sun of second set and is connectable, via third clutch, to drive shaft. Drive shaft is connectable, via first clutch, to fourth shaft connected to ring of first set and is couplable, via first brake, to the housing. Drive shaft is connectable, via second clutch, to seventh shaft connected to carrier of second set and being connectable, via fourth clutch, to third shaft which is connectable to ring of third set. Sixth shaft is connected to ring of second set and carrier of fourth set. Sun of third set is coupled to housing. Fifth shaft is connected to carrier of first set and sun of fourth set and is couplable, via second brake, to housing. Output shaft is connected to carrier of third set and ring of fourth set.

The invention provides a high-temperature component for a turbomachine, in particular for a blade or vane having a main blade or vane part and a blade or vane root, the high-temperature component at least partially comprising, as base material, a porous material which is filled with a viscous filler and is surrounded by a solid layer.

A ceiling fan comprising: a fan motor and blade assembly, a mounting tube for suspending the fan motor and blade assembly from a ceiling, and a power supply mounted within the mounting tube configured to power the fan motor. Also a ceiling fan comprising a moulded stator frame, a raised turret integrally moulded within the frame configured to enclose and mount a motor controller, and an external user changeable auxiliary module. Also ceiling fan comprising: a totally enclosed safety extra low voltage fan motor assembly configured to be suspended from an upper side, and a sealing arrangement within the assembly providing a substantial degree of ingress protection against dust and water incident from at least an under side. Also a method comprising providing a ceiling fan comprising moulded stator frame, and mounting an external user changeable auxiliary module to a raised turret integrally moulded within the frame.

Segments formed on a wiring substrate are arranged in a staggered array, and tie bars are provided between the segments.

Nine-speed multi-stage transmission with four planetary gear sets, rotatable shafts and six shift elements. Sun of first set is connected to fifth shaft which is couplable, via third brake, to housing and is connectable, via first clutch, to drive shaft which is connectable, via second clutch, to seventh shaft which is connected to ring of third set and carrier of second set. Drive shaft is connectable to eighth shaft, via third clutch, connected to carrier of first set and sun of second set. Sixth shaft is connected to ring of second set and carrier of fourth set. Fourth shaft is connected to ring of first set and sun of fourth set and is couplable, via second brake, to housing. Third shaft is connected to sun of third set and is couplable, via first brake, to housing. Output shaft is connected to carrier of third set and ring of fourth set.