Touch substrate

Abstract

The invention discloses a touch substrate. The touch substrate comprises a platy substrate, multiple first sensing serial buses, multiple second sensing serial buses and multiple patterning insulation layers, wherein the first sensing serial buses are horizontally arranged on the platy substrate and comprise multiple metal bridging lines which are arranged on the platy substrate and first sensing mats which are used for horizontally connecting adjacent metal bridging lines, the second sensing serial buses are longitudinally formed on the platy substrate, form a grid shape with the first sensing serial buses and comprise second sensing mats which are in matrix arrangement and are arranged between the first sensing mats at interval in an intersection way and bridging structures which are respectively used for connecting the second sensing mats longitudinally, and the patterning insulation layers are formed on the platy substrate and are arranged between the metal bridging lines and the bridging structures in a clamping way. According to the touch substrate disclosed by the invention, the metal bridging lines are directly formed on the surface of the platy substrate, the patterning insulation layers, the sensing mats and the bridging structure are then sequentially stacked, thus the adhesive force among the elements is increased, and the patterning insulation layers are prevented from cleaving in a manufacturing technology.

Description

technical field [0001] The invention relates to a touch substrate, in particular to a touch substrate with good adhesion between components. Background technique [0002] refer to figure 1 , is a schematic top view of a touch substrate 101 applied to a touch screen 10 at present, and the circuit structure 102 of the touch screen is surrounded by the touch substrate. [0003] Cooperate with reference figure 2 ,for figure 1 Partial view of the touch substrate. A conventional touch substrate includes a plate-like substrate 11 , a transparent conductive layer 12 , a plurality of metal bridging lines 13 , and a plurality of patterned insulating layers 14 . [0004] The transparent conductive layer 12 includes a plurality of first sensing pads 121 formed on the surface of the plate substrate 11 and arranged in a matrix, a plurality of second sensing pads 121 arranged in a matrix and spaced from the first sensing pads 121 respectively. The sensing pad 122 and a plurality of b...

AI Technical Summary

Problems solved by technology

[0010] However, since the structure of transparent conductive materials is looser than that of glass, the corrosion resistance of transparent conductive materials immersed in metal etchant (such as aluminum etchant, also known as alumina acid in the industry) is lower than that of glass. cause as image 3 The degree of adhesion between the patterned insulating layer made of low-temperature cured dielectric material and the transparent conductive layer made of transparent conductive material is significantly lower than that of Figure 4 The degree of adhesion between the patterned insulating layer made of low-temperature-cured dielectric material and the glass plate-shaped substrate leads to easy cracking at the connection edge between the patterned insulating layer and the electrode sheet or the patterned insulating layer and the bridge structure ( peeling) and warping, resulting in a low yield of the touch substrate

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