Manufacturing method of half-hole PCB (printed circuit board)
A manufacturing method and half-hole board technology, applied in the field of PCB manufacturing, can solve the problems of many burrs on the edge of the half-hole, the quality of PCB manufacturing is bottomed out, and there is no copper in the hole.
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[0018] like figure 1 Shown, it is the flow chart of the steps of the PCB semi-hole plate manufacturing method of a preferred embodiment of the present invention, comprises the following steps:
[0019] In step S101 , proceed in sequence: material cutting, drilling, plate grinding, copper sinking, plate electroplating, patterning, electroplating, etching, and solder resist treatment.
[0020] Step S102, filling the half hole to be filled with inorganic filler, the inorganic filler has the property of dehydration hardening after heating.
[0021] Step S103, proceed in sequence: baking plate, gong edge, acid solution immersion and plate washing treatment.
[0022] In this embodiment, the components of the inorganic filler in the step S102 include: gypsum powder, double fly powder and water.
[0023] The main component of gypsum powder is calcium sulfate, a white crystalline powder, odorless and hygroscopic. It usually contains 2 crystal waters, loses 1 molecule of crystal wate...
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