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Manufacturing method of half-hole PCB (printed circuit board)

A manufacturing method and half-hole board technology, applied in the field of PCB manufacturing, can solve the problems of many burrs on the edge of the half-hole, the quality of PCB manufacturing is bottomed out, and there is no copper in the hole.

Inactive Publication Date: 2013-11-13
深圳华祥荣正电子有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, PCBs manufactured in the traditional way have more burrs on the edge of the half hole, or even no copper in the hole, which leads to the quality of PCB manufacturing.

Method used

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  • Manufacturing method of half-hole PCB (printed circuit board)
  • Manufacturing method of half-hole PCB (printed circuit board)

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Experimental program
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Embodiment Construction

[0018] like figure 1 Shown, it is the flow chart of the steps of the PCB semi-hole plate manufacturing method of a preferred embodiment of the present invention, comprises the following steps:

[0019] In step S101 , proceed in sequence: material cutting, drilling, plate grinding, copper sinking, plate electroplating, patterning, electroplating, etching, and solder resist treatment.

[0020] Step S102, filling the half hole to be filled with inorganic filler, the inorganic filler has the property of dehydration hardening after heating.

[0021] Step S103, proceed in sequence: baking plate, gong edge, acid solution immersion and plate washing treatment.

[0022] In this embodiment, the components of the inorganic filler in the step S102 include: gypsum powder, double fly powder and water.

[0023] The main component of gypsum powder is calcium sulfate, a white crystalline powder, odorless and hygroscopic. It usually contains 2 crystal waters, loses 1 molecule of crystal wate...

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PUM

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Abstract

A manufacturing method of a half-hole PCB comprises the steps as follows: cutting, drilling, plate grinding, PTH (plating through hole), PP (panel plating), pattern plating, electroplating, etching and solder mask treatment are sequentially performed; holes to be subjected to half-hole routing are filled with an inorganic filler which has the characteristic of dehydration and hardening after the inorganic filler is heated; and board baking, routing, acid dip and board washing treatment are sequentially performed. According to the manufacturing method of the half-hole PCB, the holes are filled with the inorganic filler before the routing process is performed, and the inorganic filler is hardened after the board baking process is performed, so that the hole edges and the copper layers in the holes are protected and supported, and the following routing process is not prone to generate flashes or damage the copper layers in the holes; and moreover, the inorganic filler can be simply removed through cleaning by the acid liquor, through experimental verification and comparison with a traditional mode, the problems of half-hole flashes and absence of copper in the holes are solved, and the production efficiency and quality of the half-hole PCB are improved.

Description

technical field [0001] The invention relates to a method for manufacturing a PCB, in particular to a method for manufacturing a PCB half-hole plate. Background technique [0002] With the development of modern electronic products in the direction of light, thin, short and small, the circuit board as the cornerstone of electronic products has given more functions. Or a connected class of special products. There are more and more half-hole products, and the processing requirements and difficulties are also increasing. The traditional PCB half-hole board production process is as follows: [0003] Cutting, drilling, milling, copper sinking, plate electrical, graphics, electroplating, half-hole edge, etching, solder mask, baking plate, edge edge, plate washing. [0004] However, PCBs manufactured in the traditional way have more burrs on the edges of the half holes, and even have no copper in the holes, resulting in a low-quality PCB manufacturing. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40
Inventor 王根长王长元
Owner 深圳华祥荣正电子有限公司