Unlock instant, AI-driven research and patent intelligence for your innovation.

Modeling method of interconnection structure and automatic generation method of interconnection resource allocation vector

A technology of interconnecting resources and automatic generation, which is applied in the field of FPGA, can solve the problems of partial testing and low PIP test coverage, and achieve the effects of high test efficiency, convenient transplantation, and high test coverage

Active Publication Date: 2016-01-20
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method of the literature (Application-IndependentTestingofFPGAInterconnects) and the literature (Shenyang Institute of Automation, Chinese Academy of Sciences. An FPGA testing method based on the maximum flow method [P]. Invention patent, CN102116839A, 2011-07-06) can only do global testing, not Partially tested, and poor test coverage for PIP

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modeling method of interconnection structure and automatic generation method of interconnection resource allocation vector
  • Modeling method of interconnection structure and automatic generation method of interconnection resource allocation vector
  • Modeling method of interconnection structure and automatic generation method of interconnection resource allocation vector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Concrete implementation steps of the present invention are as follows:

[0024] Step 1) Establish the IR model of the FPGA according to the switch box structure of the specific FPGA chip. Firstly, the metal wires in the chip are classified, and the metal wires of the same type are collectively called a layer. The connection between the two metal wires can only be established through the PIP in the switch box. The PIP between the same kind of metal lines is called intra-PIP, and the PIP between different kinds of metal lines is called inter-PIP. Each layer is a point, all layers constitute a point set V, and the connection relationship of PIP is an edge, and an IR model is established;

[0025] Step 2) Transform the IR model into an adjacency matrix A. Each element in the matrix A corresponds to the ring or directed edge in the IR model. The element Di in the i-th row and i-column corresponds to the ring Di of layer_i in the model, and the element Di-j in the i-th row...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The interconnection structure modeling method and the interconnection resource allocation vector automatic generation method belong to the FPGA technology. The interconnection structure modeling method of the present invention includes the following steps: first classify the metal wires in the chip, the metal wires of the same type are collectively called a layer, and only the programmable configuration point PIP in the switch box is used between the two metal wires. In order to establish a connection, the PIP between the same metal lines is called intra-PIP, and the PIP between different metal lines is called inter-PIP; then all layers are used as points, and the connection relationship of PIPs is used as edges to establish a graph. The invention can automatically generate test configurations and has high test efficiency. The present invention has a high test coverage rate for interconnection resources, especially for PIP coverage. The invention is not aimed at a specific type of FPGA, but can be used for SRAM-type FPGA testing, has good versatility and is convenient for transplantation. The invention can achieve more accurate fault location and diagnosis.

Description

technical field [0001] The invention belongs to FPGA technology. Background technique [0002] The SRAM type Field Programmable Gate Array (Field Programmable Gate Array, hereinafter referred to as FPGA) is mainly composed of a programmable logic cell array, input and output modules, intellectual property cores, and a large number of interconnect resources (InterconnectResource, hereinafter referred to as IR). [0003] In the SRAM-based FPGA interconnection resource test, due to the variety of interconnection resources, the connection relationship is complex and changeable, and the interconnection lines and Programmable InterconnectPoint (PIP) are inside the chip, occupying a large chip area, the test has been is a difficult problem to solve. [0004] With the development of modern FPGAs, interconnect resources are becoming more and more complex, and their proportion in FPGAs is increasing, and even close to 90% of FPGAs with tens of millions of gates, so the probability of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/3185
Inventor 阮爱武万理杨钧皓介百瑞
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA