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A system package chip capable of testing internal signals and a testing method thereof

A system packaging and internal signal technology, applied in error detection/correction, instrumentation, electrical digital data processing, etc., can solve problems such as poor signal testability, achieve the effect of occupying less design resources, reducing testing costs, and being easy to implement

Active Publication Date: 2016-05-04
NO 8357 RES INST OF THE THIRD ACADEMY OF CHINA AEROSPACE SCI & IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The purpose of the present invention is to provide a testability design that can be applied to the internal signals of the system package chip, such as bus signal and key signal connectivity, signal integrity, protocol correctness, etc., to solve the problem of poor testability of the internal signal of the system package chip system question

Method used

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  • A system package chip capable of testing internal signals and a testing method thereof
  • A system package chip capable of testing internal signals and a testing method thereof
  • A system package chip capable of testing internal signals and a testing method thereof

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Embodiment Construction

[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0030] A typical system-in-package chip architecture diagram is shown in figure 1 As shown, the design must include at least one CPU or DSP processor chip, memory, and execution components to form a chip with system functions. Other power chips, clock chips, etc. can be flexibly configured according to different systems. The system-in-package chip integrates functions together. Therefore, many signals of the internal chip cannot and are not necessary to be led out of the package. However, if the internal complex signal connections are not fully tested, it will bring great risks to the quality and reliability of SoP chip products. Therefore, the present invention aims at the above problems, utilizes the characteristics of devices in the system package chip, and uses a small number of test pins and programmable logic device chips to realize the...

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Abstract

The invention discloses a system packaging chip capable of testing internal signals and a test method. The chip comprises a PLD (programmable logic device) type chip and a plurality of external test pins. The test method comprises the steps as follows: 1), the chip is powered up to enter a test mode; 2), the connectivity of a bus between a processor chip and a PLD is tested through the external test pins; 3), a bus protocol is tested; and 4), the connectivity of the PLD and an executive component in the system packaging chip and the reliability of data transmission are tested through the external test pins. According to the system packaging chip capable of testing the internal signals and the test method, signals of an internal bus of the system packaging chip and key signals are tested by using least devices, the test method doesn't damage package of the system packaging chip completely, and the test method is flexible and variable and can be configured flexibly according to different designs.

Description

technical field [0001] The invention relates to a method for testing internal signals of a system package chip, which can realize the test of the internal bus connectivity, signal integrity, protocol correctness, etc. of the system chip through limited test pins. Background technique [0002] System-in-Package (SiP) technology is a system miniaturization integration technology that has developed rapidly in recent years, and it is one of the key technologies for achieving integrated circuit integration in the post-Moore era to maintain "Moore's Law" growth. System packaging mainly uses 3D packaging technology to put various original chips with complete system functions into a chip package to realize the integration of system functions and the reduction of volume and weight. , Shell design, processing and manufacturing technology and other advanced design and processing technologies are highly cross-integrated products. [0003] Because system packaging technology can realize...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F11/267
Inventor 朱天成李鑫郑炜杨阳张兴起车杨
Owner NO 8357 RES INST OF THE THIRD ACADEMY OF CHINA AEROSPACE SCI & IND