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Aluminum wire rework method

A line and process technology, applied in the field of semiconductor component manufacturing, can solve problems such as scrap, low product yield, and increased manufacturing costs

Active Publication Date: 2016-08-03
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will lead to low product yield or scrap, resulting in waste of resources and increased manufacturing costs

Method used

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  • Aluminum wire rework method
  • Aluminum wire rework method

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Embodiment Construction

[0017] One embodiment of the present invention provides a method for reworking aluminum lines that can be used in the wafer production process after repeated processes for producing aluminum lines. The method for reworking aluminum lines includes the following steps:

[0018] Remove the aluminum lines on the wafer surface, repair the wafer surface, and make up the aluminum lines.

[0019] Through the above steps, the purpose of reworking the aluminum lines of repeated processes can be achieved. In this way, the scrapping of wafers with repeated processes of aluminum lines can be avoided, and the purpose of reducing waste and cost can be achieved.

[0020] Please refer to figure 1 , figure 1 It shows that aluminum line repeating process occurs during the process of growing aluminum lines on the wafer surface. The details are as follows.

[0021] In the semiconductor manufacturing process, a process of growing aluminum lines is reached through a series of processes.

[0022...

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Abstract

Provided is an aluminum wire reworking method applied to the wafer producing process after aluminum wire repeated process is generated. The aluminum wire reworking method includes the steps of eliminating aluminum wires on the surface of a wafer, repairing the surface of the wafer and lengthening the aluminum wire through repairing, in detail, firstly stripping two layers of aluminum wires which grow on the surface of the wafer needing to be reworked, and then re-growing new aluminum wires so as to enable the wafer subjected to aluminum wire repeated process to return to a normal state. The aluminum wire reworking method can avoid scrapping of problem wafers and achieve the purposes of reducing waste and cost.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor element, in particular to a method for reworking aluminum lines. Background technique [0002] The manufacturing process of semiconductor components is very complicated, and usually requires hundreds of process steps to complete the production of a product. Among them, the aluminum wire strips are often used as connecting wires between the device layer and the external gold wires. Generally, there are one to two layers of aluminum lines in a semiconductor device with a larger line width, and in some semiconductor devices with a smaller line width, the number of layers of aluminum lines may be increased to seven or eight layers. Therefore, its process plays a vital role in the semiconductor production process. Then, during the growth process of the aluminum lines, there will be a phenomenon that the growth of the aluminum lines is unqualified. For example, repetitive processes occur,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L21/02
Inventor 闵炼锋刘长安
Owner CSMC TECH FAB2 CO LTD