Encapsulation process method of dual-interface card and self-adhesive tape sticking mechanism
A packaging process, dual-interface card technology, applied in computer parts, record carriers used in machines, instruments, etc., can solve problems such as low wire take-up efficiency
Active Publication Date: 2016-06-08
中电智能卡有限责任公司
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Problems solved by technology
[0010] The purpose of the present invention is to provide a packaging process method for a dual-interface card and its self-adhesive tape sticking mechanism, so as to simplify the packaging process of the existing dual-interface card, overcome the shortcoming of low thread-taking efficiency in the prior art, and further improve the product Performance, improve production efficiency, reduce raw material cost and processing cost
Method used
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[0032] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described with reference to the accompanying drawings.
[0033] Such as Figure 1 to Figure 6 As shown, the present invention proposes a packaging process method for a dual-interface card, the packaging process method comprising the following steps:
[0034] (1) Provide a dual-interface card base 9 with an antenna already implanted, mill an outer groove 91 at a predetermined position on the card base 1, and leak out the antenna thread 92 of the dual-interface card (such as figure 1 shown);
[0035] (2) The antenna position is cyclically scanned by the laser mechanism, which includes a laser transmitter and a controller for controlling the laser track; the antenna position is the antenna track or the antenna area; the controller controls the laser transmitter to scan the card Based on...
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The invention discloses a packaging technology method of a double-interface card and a non-setting adhesive tape sticking and lifting mechanism of the double-interface card. According to the technology method, an outer groove is milled in a card base so as to expose an antenna of the double-interface card; laser is used for heating an antenna track or an antenna area so as to enable the antenna to be dissociated from the card base, and then non-setting adhesive tape is used for pulling up the antenna; an inner layer groove is milled in the card base pulling up the antenna; an outer welding disk of a module is welded with the antenna which is pulled up. According to the technology method, the instantaneous focusing high temperature of laser is used for gasifying the card base around the antenna, so that the antenna can be disassociated from the card base in a short time, the packaging speed of the double-interface card can be greatly improved, smooth conduction of packaging of the double-interface card can be ensured, the problems, such as line breakage and low line picking efficiency, appearing in the line picking technology can be avoided, the problem that no high-speed and stable automatic packaging equipment exists in the intelligent card industry at home and abroad is solved, the processing process is simplified, production efficiency is improved, the performance of products is improved, and processing cost is greatly saved.
Description
technical field [0001] The invention relates to a packaging technology for a dual-interface card, in particular to a packaging process method for a dual-interface card and a self-adhesive tape sticking mechanism. Background technique [0002] At present, with the development of science and technology, smart cards have been applied to various fields. Smart cards mainly include contact smart cards, contactless smart cards and dual-interface cards. Dual-interface card refers to a smart card that has two functions of contact smart card and contactless smart card; dual-interface card is more and more popular because of its comprehensive functions. [0003] The packaging of the dual interface card is to connect the antenna on the card base with the smart card chip to form a finished dual interface card. There are four main packaging processes for existing dual-interface cards: [0004] The first is to manually pick up the antenna, and directly solder the dual-interface module an...
Claims
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IPC IPC(8): G06K19/077
Inventor 李建军魏云海王久君朱鹏林宋佐时王晓亮张宝春
Owner 中电智能卡有限责任公司