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An electrostatic discharge protection device

A protection device and electrostatic discharge technology, applied in the electronic field, can solve problems such as increased chip cost, failure to form a current path, and overall chip performance degradation

Active Publication Date: 2016-05-18
陈茂奎
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this current is provided in an abnormal way, and the resistance on the path is relatively large, not only the chips connected in series cannot work normally, but also because the power-on reset cannot be performed normally and some logic enters an abnormal state, resulting in The entire circuit does not work properly when powered on normally
The occurrence of this situation seriously affects the working performance of the entire chip
[0004] In order to solve the above problems, the existing ESD replaces a single diode connected to the power supply terminal with multiple larger diodes in series, so that no current path can be formed between the chips connected in series and the chips that are working normally.
In order to ensure that the ESD structure in series can have the same conductivity as a single diode, the size of the diode must be multiplied by the number of diodes in series. There are multiple I / O interfaces in a chip, and each interface requires an ESD , so this ESD structure will lead to an increase in the cost of the chip and a decrease in the overall performance of the chip

Method used

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Embodiment 1

[0028] see figure 1 , which is a schematic structural diagram of an electrostatic discharge protection device disclosed in Embodiment 1 of the present application. The device includes: a first unit 101 and a second unit 102. It should be noted that, in figure 1 In the second unit 102 in , it is only explained that each branch contains two diodes as an example. The following will further introduce its internal structure and connection relationship in combination with the working principle of the device.

[0029] A first unit and a second unit, the first unit 101 is connected in series with the second unit 102;

[0030] The first unit includes: at least two branches, each branch is connected in parallel with each other, and each branch has the same structure, and the branches include: two diodes, one end of which is connected to the I / O, and the other ends of which are respectively reversely connected in the second unit and above ground;

[0031] The second unit includes: at ...

Embodiment 2

[0046] The following explains an electrostatic discharge protection device of the present invention in specific application scenarios, specifically: when a certain system has only four I / O interfaces, a device capable of supporting electrostatic discharge of four I / O interfaces is required, specifically Such as figure 2 A schematic diagram of the structure of an electrostatic discharge protection device. In order to avoid the phenomenon of series electricity between chips, the device specifically includes:

[0047] The first unit 201 includes: four branches connected in parallel, and each branch has the same structure, and the branches include: two diodes, one end of which is connected to the I / O, and the other end of which is respectively reversely connected to the second unit and the ground;

[0048] The second unit 202 includes: two branches, each branch includes: two diodes connected in series, and the cathode after series connection is connected to the power supply;

...

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PUM

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Abstract

The embodiment of the invention discloses an electrostatic discharge protective device. The electrostatic discharge protective device comprises a first unit and a second unit which are connected with each other in series, wherein the first unit comprises at least two branches which are connected with each other in parallel, each branch comprises two diodes, one ends of the two diodes are connected to I / O (input / output) interfaces, and the other ends of the two diodes are respectively and reversely connected to the second unit and the ground; the second unit comprises at least one branch, the branch comprises at least two diodes which are connected in series, and after the two diodes are connected in series, the negative poles of the diodes are connected to a power source. The electrostatic discharge protective device has the advantages that the network structure with powerful discharging capacity is formed in a series-connection and parallel-connection combination manner, the diodes connected to the I / O interfaces are relatively small in size, the diodes connected to the power source are relatively large in size, the electrostatic discharge functions of the multiple I / O interfaces can be realized by adopting the structure, the number of the diodes with the large size is reduced, and the layout area and the cost of chips are reduced.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electrostatic discharge protection device for semiconductor integrated circuit chips. Background technique [0002] ESD (Electro-Static Discharge) refers to electrostatic discharge. It is customary in the world to refer to the equipment used for electrostatic protection as ESD, and it is also called electrostatic impedance in my country. Electrostatic discharge is known as the biggest potential killer of electronic product quality, so electrostatic protection has also become an important content of electronic product quality control. [0003] The ESD of the diode is a protection device for electrostatic discharge provided by the chip interface, and is widely used in various types of chips. In practical applications, there are two connection modes for the connection between the chip and the outside world: DC coupling and AC coupling. In the case of DC coupling, the I / Os o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02
Inventor 陈茂奎
Owner 陈茂奎