An omnidirectional light-emitting flip-chip led chip

Abstract

The invention relates to an inverted LED chip capable of emitting light omni-directionally. The inverted LED chip capable of emitting the light omni-directionally comprises a P type welding electrode and an N type welding electrode, wherein the P type welding electrode and the N type welding electrode are located at the bottom of the chip. A first reflecting layer is arranged on the upper side of the P type welding electrode and covers the upper surface of the P type welding electrode, and the first reflecting layer can reflect light towards the P type welding electrode and have electrical conductivity. A second reflecting layer is arranged on the upper side of the N type welding electrode and covers the upper surface of the N type welding electrode, and the second reflecting layer can reflect light towards the N type welding electrode and have electrical conductivity. By installing the reflecting layers on the welding electrodes, the light towards the welding electrodes is used effectively, and the use rate of the light is increased; by the adoption of welding of a transparent substrate, the light can be emitted omni-directionally, and the inverted LED chip of the structure is applicable to an indoor LED bulb with the requirement for omni-directional illumination.

Description

technical field [0001] The invention belongs to the field of optoelectronic technology, and in particular relates to a flip-chip LED chip capable of emitting light in all directions. Background technique [0002] Compared with formal LED chips, flip-chip LED chips have better heat dissipation function and luminous efficiency, and have the advantages of low voltage, high brightness, high reliability, high saturation current density, etc., and have great advantages in performance , has a good development prospect. [0003] At present, the packaging of flip-chip LED chips first prepares a flip-chip LED chip suitable for eutectic welding, and prepares a silicon base plate of a corresponding size at the same time, and makes a gold conductive layer and a lead-out conductive layer (ultrasonic gold wire) of the eutectic welding electrode on it. ball solder joints). Then, use eutectic welding equipment to weld the flip-chip LED chip and the silicon substrate together. According to...

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Problems solved by technology

[0004] Since the packaging solder and welding electrodes of the existing flip-chip LED chips are opaque, the part of the light emitted by the light-emitting layer to the welding electrodes will be absorbed and cannot be effectively utilized. In addition, due to welding reasons, the bottom surface of the flip-chip LED chip It is usually opaque, the light emitted by the chip can only be emitted from the five sides of the chip, and no light passes through the bottom surface

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