Environmentally-friendly lead-free soldering tin paste of novel superfine soldering tin powder

Abstract

The invention discloses an environmentally-friendly lead-free soldering tin paste of novel superfine soldering tin power. The environmentally-friendly lead-free soldering paste is made of components including, by weight, 40-50 parts of tin, 0.1-1 part of copper, 0.1-1 part of nickel, 0.1-1 part of modified hydrogenated castor oil, 0.1-2 parts of hydrogenated rosin, 50-60 parts of spherical alloy soldering powder, 2-5 parts of polyamide. By means of vacuum degassing, a paste soldering flux system is prevented from producing bubbles due to high viscosity, so that stability of paste soldering flux is improved, and stability of lead-free soldering paste products is further improved.

Description

technical field [0001] The invention relates to a lead-free solder, in particular to an environment-friendly lead-free solder paste of novel superfine solder powder. Background technique [0002] There are many types of lead-free solder paste, and the preparation processes are also different. If the preparation process is not strictly controlled, there will be certain problems in the solder paste. It is easy to generate bubbles in the system, and the creamy flux mixed with air bubbles will eventually affect the stability of the solder paste. Secondly, with the development of ultra-fine-pitch surface mount, it is necessary to adapt to the dispensing and printing solder paste products, that is to say, the solder powder must develop towards ultra-fine particles, and ultra-fine particle powder is easy to oxidize and follow. The chemical reaction of the paste solder leads to poor stability and solderability of the solder paste, and it is also prone to solder balls, collapse and ...

AI Technical Summary

Problems solved by technology

[0002] There are many types of lead-free solder paste, and the preparation processes are also different. If the preparation process is not strictly controlled, there will be certain problems in the solder paste. It is easy to generate air bubbles in the system, and the paste flux mixed with air bubbles will eventually affect the stability of the solder paste

Secondly, with the development of ultra-fine-pitch surface mount, it is necessary to adapt to the dispensing and printing solder paste products, that is to say, the solder powder must develop towards ultra-fine particles, and ultra-fine particle powder is easy to oxidize and follow. The chemical reaction of the paste solder leads to poor stability and solderability of the solder paste, and it is also prone to solder balls, collapse and other undesirable phenomena