Method for manufacturing printed circuit board and printed circuit board

Abstract

The invention discloses a method for manufacturing a printed circuit board and the printed circuit board. The method comprises the steps that a through hole is formed between every two bonding pads of a chip, and the through holes are communicated with one side, where the chip is located, of the PCB and the other side of the PCB; on the other side of the PCB, a capacitor is arranged between every two through holes, each capacitor is provided with two ends, each end of the capacitors is provided with a bonding pad, the bonding pads at the two ends of the capacitors are in central symmetry with the central connecting line of two through holes, and the edges of the bonding pads at the two ends of the capacitors are distributed to be tangential to the edges of the hole plates of the through holes; the capacitors are connected with the chip through the through holes. The corresponding printed circuit board is further disclosed. The space clearances of the through holes in the printed circuit board are reasonably utilized, the number of the distributed filter capacitors can be effectively increased, and the signal quality of elements in the printed circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a printed circuit board and a printed circuit board. Background technique [0002] Currently, Ball Grid Array (BGA) chips have higher and higher requirements on signal quality on Printed Circuit Board Assembly (PCBA), and usually capacitors are used to filter out interference signals to improve signal quality. [0003] For a BGA chip with a pin pitch of 0.8mm to implement a capacitor filtering scheme on the PCB board, one method in the prior art is: using 0402 type capacitors for layout and using resin plug holes and surface electroplating (Plating Over Filled Via, POFV) ) processing technology, but the number of layout filter capacitors is small and the location is limited, which cannot meet the product's requirements for signal quality and high-density assembly, and the POFV processing technology has a great impact on product cost and ca...

AI Technical Summary

Problems solved by technology

[0003] For the BGA chip with 0.8mm pin spacing to realize the capacitive filtering scheme on the PCB board, a method in the prior art is: adopt 0402 type electric capacity to carry out layout and adopt resin plug hole to add surface electroplating (Platating Over Filled Via, POFV ) processing technology, but the number of layout filter capacitors is small and the location is limited, which cannot meet the product's requirements for signal quality and high-density assembly, and the POFV processing technology has a great impact on product costs and cannot meet the requirements of peer cost competition.

[0004] Another method is to use 0201 type capacitors for layout and POFV technology, which still has high PCB processing costs, and similar products do not have cost competitive advantages

[0005] Another way is, if figure 1 As shown, on the other side of the PCB side where the 0.8mm BGA chip is located, between the two via holes (VIA holes) 310, the 0201 capacitors are laid out at 45°, but this method needs to be adjusted for the pin signals of the BGA chip. Definition, it is difficult to realize on the circuit, and the number of 0201 capacitors in the layout is limited

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