Vacuum forming device and vacuum forming method

Abstract

The invention provides a vacuum forming device and a vacuum forming method. A workpiece and a membrane are provided for a lower mould frame. An upper moulded board is used for pressing the lower mould frame so as to enable the membrane to be pressed by the upper moulded board and to maintain the membrane to be at a smooth state. The lower mould frame and the upper moulded board are raised by a height, the workpiece separates from the lower mould frame, and the membrane is heated by a heater for a heating period and the bottom end of the lower mould frame for a heating time. The workpiece is bonded again with the lower mould frame, and the upper moulded board provides a positive pressure for the membrane while the lower mould frame provides a negative pressure for the membrane so as to enable the membrane to bond with the workpiece. Therefore, the smoothness of the membrane is maintained, the alignment precision between the membrane and the workpiece is raised so as to avoid ripples of the products, and forming time of the membrane is also shortened.

Description

technical field [0001] The invention relates to a vacuum forming method and its device, which provides a method and its device for combining a film and a workpiece by using vacuum. Background technique [0002] Three Dimension Overlay Method (Three Dimension Overlay Method), which uses vacuum pressure or atmospheric pressure to make a thin film adhere closely to the surface of a workpiece. [0003] The steps of the three-dimensional covering method are: [0004] 1. Set a workpiece at the jig of the lower cavity, and set a film between the upper cavity and the lower cavity. [0005] 2. The upper cavity and the lower cavity are combined with each other so that a closed space is formed between the upper cavity and the lower cavity. [0006] 3. The heater located in the upper chamber heats the film, and the upper chamber and the lower chamber form a vacuum state, that is, a negative pressure state. [0007] 4. After heating for a predetermined time, the jig moves towards the ...

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Problems solved by technology

[0009] However, the above-mentioned three-dimensional covering method still has its disadvantages. Because the upper chamber is a hollow body, the film is suspended between the upper chamber and the lower chamber, and the pressure difference between the upper chamber and the lower chamber will cause the film to drift. state, which in turn affects the alignment accuracy between the film and the workpiece, and the product is prone to wrinkles. In addition, the existing film heating method often takes a long time to form

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