Intensive busway

Abstract

The invention discloses an intensive busway. The intensive busway comprises a plug box, a busway housing and a plurality of buses, wherein the plug box is arranged at the upper end of the busway housing; the buses are arranged inside the busway housing; the plug box comprises a box body, two pairs of guiding plates, a fixing plate and a plurality of pin assemblies; a pair of guiding plates are arranged at two ends of the box body respectively; the fixing plate is arranged at the bottom of the box body; the pin assembly comprises a pin, a pair of reeds and a pair of pin copper sheets; the busway housing comprises a pair of H sectional materials and a pair of U sectional materials; the H sectional materials are connected through the U sectional materials; the number of the buses is equal to the that of the pin assemblies. The intensive busway is good in sealing performance, large in heat dissipating area, low in cost, easy in operation and high in yield.

Description

technical field [0001] The invention relates to a bus duct, in particular to a dense bus duct, which belongs to the field of electrical technology. Background technique [0002] At present, the intensive busway is composed of busway shell, busbar, and pin components. The busway shell includes H-shaped and U-shaped materials. The H-shaped material is made of aluminum-magnesium alloy (6063T5). L2Y2) is folded and treated with plastic spraying, H profile and U profile are riveted with rivets; pin components include pins, pin reeds and pin copper sheets, the three are riveted together with rivets, the busbar is provided with sockets, and the pin components are connected with socket connection. [0003] However, the contact surface between the H profile and the U profile of this structure is flat, and the sealing performance is not good; the U profile is folded with aluminum plate, the mechanical strength is not enough, and the heat dissipation performance is not good enough; th...

AI Technical Summary

Problems solved by technology

[0003] However, the contact surface between the H profile and the U profile of this structure is flat, and the sealing performance is not good; the U profile is folded with aluminum plate, the mechanical strength is not enough, and the heat dissipation performance is not good enough; the pin reed and the pin copper sheet of the pin assembly are too thin , the strength is not enough, and it is easy to deform; the connection between the pin assembly and the socket is in surface contact, the pressure of the pin assembly on the socket is not enough, and the carrying capacity cannot meet the requirements; during the installation and transportation process, the guide foot assembly is easy to deform, and the pin assembly may There will be mechanical collision, which will damage and deform the pin assembly

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