Grinding wheel containing grinding materials and thermal expansion resin hollow microspheres

A hollow microsphere, thermal expansion technology, used in abrasives, bonded grinding wheels, metal processing equipment, etc., can solve problems such as poor heat dissipation, natural fiber carbonization, failure, etc., to improve service life, avoid breakage and drop, improve structure the effect of strength

Inactive Publication Date: 2014-01-29
谢泽
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Various polishing and grinding tools currently produced have the following defects: compact structure, poor heat dissipation, such as resin grinding wheels (due to hydraulic molding, dense structure)
However, natural fibers will also carbonize and fail under such conditions

Method used

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  • Grinding wheel containing grinding materials and thermal expansion resin hollow microspheres
  • Grinding wheel containing grinding materials and thermal expansion resin hollow microspheres
  • Grinding wheel containing grinding materials and thermal expansion resin hollow microspheres

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1 (exploring the relationship between the addition of thermally expandable resin hollow microspheres and the polishing effect)

[0031] Explanation: The proportion of binder and abrasive in this formula is determined by mixing the binder and abrasive in different proportions and making splines for curing, then testing the mechanical performance indicators such as elastic modulus, tensile strength, elongation at break, etc. It is determined by screening out a large number of experimental data.

[0032] Proportion:

[0033]

[0034] 1 sample production

[0035] 1. Sample making

[0036] 1.1 Mixing: according to the ratio of each style formula in formula 1, weigh the natural fibers in turn, (such as making a plane polishing wheel for flat polishing, use a fine number, and make a circumferential polishing wheel for circumferential polishing, then use a thick number), in the stirring state Add the heat-expandable resin hollow microspheres to ensure uniform stir...

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PUM

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Abstract

The invention discloses a grinding wheel containing grinding materials and thermal expansion resin hollow microspheres. The grinding wheel is prepared by raw materials including the grinding materials, the thermal expansion resin hollow microspheres and binding agents. Polishing effect and grinding efficiency of the grinding wheel can be controlled by regulating the proportion of the grinding materials and the thermal expansion resin hollow microspheres.

Description

technical field [0001] The invention relates to a grinding wheel containing abrasive material and thermal expansion resin hollow microspheres, belonging to the field of abrasive tools. Background technique [0002] Various polishing and grinding tools currently produced have the following defects: compact structure, poor heat dissipation, such as resin grinding wheels (due to hydraulic molding, compact structure). [0003] General resin-bonded grinding wheels (bonded abrasives) are mainly made of abrasives and resin binders after mixing, molding, and heating and hardening. The use of this type of grinding wheel has problems such as the need for large cutting forces and serious heating of the workpiece. defect. [0004] The pores in the large porous grinding wheel (bonded abrasive) are generally filled with fillers (such as walnut shells, refined naphthalene, etc.) that can be burned (ie carbonized) at temperatures above 130 degrees during hardening treatment. fall into. H...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28B24D7/10B24D5/10
Inventor 谢泽
Owner 谢泽
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