Cutting method of crystal silicon block

Abstract

The invention provides a method for cutting crystalline silicon blocks. The method comprises the steps of detecting the crystalline silicon blocks and removing the heads and the tails of the crystalline silicon blocks; mixing solidification components and dissolution components according to a certain ratio to make silica gel; placing clamping plates on a cutting platform; arranging the crystalline silicon blocks side by side and bonding the crystalline silicon blocks to the clamping plates through the silica gel, wherein a clearance between every two adjacent crystalline silicon blocks is fully filled with the silica gel; scrapping residual silica gel between the crystalline silicon blocks and the clamping plates and between the crystalline silicon blocks to be flat; cutting the crystalline silicon blocks after the silica gel located between the crystalline silicon blocks to be cut and the clamping plates and the silica gel in the clearances are aired. According to the method for cutting the crystalline silicon blocks, the clearances between the adjacent crystalline silicon blocks are fully filled with the silica gel, the clearances between the crystalline silicon blocks are eliminated, stress on steel wires in the crystalline silicon block cutting process is even, and therefore the problem that the steel wires are oblique and jump due to the clearances between the crystalline silicon blocks is avoided, and the yield of crystalline silicon block cutting is improved.

Description

technical field [0001] The invention relates to the technical field of solar cell production, in particular to a method for cutting a crystalline silicon block. Background technique [0002] With the emergence of non-renewable energy crises such as coal and oil, people gradually began to use solar energy. Solar cells are one way of harnessing the sun's energy. [0003] At present, crystalline silicon cells as solar cells are widely produced and used. See figure 1 , in the process of producing crystalline silicon cells, it is necessary to cut the produced crystalline silicon block 4 into qualified crystalline silicon wafers. The crystalline silicon block 4 is usually cut with a wire saw, that is, the crystalline silicon block 4 is cut through a high-speed moving steel wire. Several crystalline silicon blocks 4 need to be placed on the splint 1 before cutting, and each crystalline silicon block is placed close to each other. Generally, silica gel 2 is used to bond the crys...

AI Technical Summary

Problems solved by technology

[0005] In addition, during the cutting process, due to the high-speed movement of the steel wires, the gaps between the crystalline silicon blocks 4 are also likely to cause the steel wires to break, and the steel wires need to be repaired, which delays the cutting process to a certain extent and reduces the cutting time of the crystalline silicon blocks. 4 work efficiency

Images