A semiconductor air conditioner
A semiconductor and N-type semiconductor technology, applied in air conditioning systems, space heating and ventilation, heating methods, etc., can solve problems such as waste of electric energy, pollution, refrigerant leakage, etc., to improve cooling efficiency and ensure work stability , Increase the effect of heat dissipation area
Active Publication Date: 2016-06-01
BEIJING FULLLINK OREITH TECH CO LTD
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Problems solved by technology
[0002] At present, the air-conditioning system used to control the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, resulting in unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollution to the environment
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[0016] Such as figure 1 The schematic diagram of the internal structure of the semiconductor air conditioner of the present invention is shown, including N-type semiconductor module one (11), N-type semiconductor module two (12), P-type semiconductor module one (21), P-type semiconductor module two (22), One metal deflector (31), three metal deflectors (32), five metal deflectors (33), two metal deflectors (41), four metal deflectors (42), one terminal (5 ), terminal two (6), cold air channel ventilation fan (7), hot air channel ventilation fan (8), substrate one (9), substrate two (10) and control circuit; channel; the two forced ventilation fans include a cold air channel ventilation fan (7) and a hot air channel ventilation fan (8); the base plate is two insulating plates; one of the metal deflectors (31) One side is in close contact with the substrate one (9), and a terminal one (5) is provided between the metal deflector one (31) and the substrate one (9); the other side...
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The invention discloses a semiconductor air conditioner which is mainly composed of a plurality of N type semiconductor modules, a plurality of P type semiconductor modules, a plurality of metal diversion boards, two substrates, two forced ventilation fans and two wiring ends. Airflow channels are formed in the metal diversion boards, and the substrates are two insulating and heat insulating boards. The N type semiconductors and the P type semiconductors are alternatively inserted between adjacent metal diversion boards in a penetrating mode, and the airflow channels in two adjacent metal diversion boards are vertical. Thus, cold and hot air ducts of the semiconductor air conditioner arranged and composed according to the sequence are separated and the metal diversion boards are directly used as cooling fins, and therefore the refrigerating efficiency of the semiconductors is improved and the semiconductor air conditioner is safe, reliable and free of environmental pollution.
Description
technical field [0001] The invention relates to the technical field of thermoelectric refrigeration with refrigeration effect, in particular to a semiconductor air conditioner. Background technique [0002] At present, the air-conditioning system used to regulate the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, which leads to unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollution to the environment. Contents of the invention [0003] In order to solve the problems existing in the prior art, the present invention provides a semiconductor air con...
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IPC IPC(8): F24F5/00F25B21/02
Inventor 祝长宇丁式平
Owner BEIJING FULLLINK OREITH TECH CO LTD