Knowledge base-based three-dimensional X-ray computed tomography (CT) detection system and method

Abstract

The invention discloses a knowledge base-based three-dimensional X-ray computed tomography (CT) detection system. The system comprises a data acquisition module, a slice reconstruction module, an image segmentation module, an image registration module, a defect detection module and a knowledge base management module, wherein the data acquisition module is used for acquiring CT projection data; the slice reconstruction module is used for reconstructing a two-dimensional slice according to the acquired CT projection data and recovering a slice CT image; the image segmentation module is used for segmenting the CT image information of an important part of the chip for the slice CT image; the image registration module is used for performing registration on the CT image to be detected and the standard CT image and finding out the correspondence between the two to realize comparability of the corresponding parts; the defect detection module is used for extracting CT image characteristic of a chip to be detected, comparing with corresponding characteristic of the standard CT image of the chip in a knowledge base and judging whether the chip to be detected is defective and judging the type of the defect. The system and the method are accurate in defect positioning and high in quality detection accuracy.

Description

technical field [0001] The invention relates to the field of quality inspection of the three-dimensional packaging process of precision electronic high-end chips, in particular to a knowledge-base-based three-dimensional X-ray tomographic detection system and method applied in the high-end chip packaging process. Background technique [0002] The three-dimensional packaging of precision electronic high-end chips, in addition to the general two-dimensional packaging technology, also uses complex packaging technologies such as multi-layer wiring or interlayer stacking and interconnection. These technologies make SiP chips from bare chips to packaging and printing The quality inspection of circuit boards has become more difficult. [0003] When using two-dimensional X-ray imaging technology to inspect three-dimensional packaged devices, because all layers of the three-dimensional packaged device are seen at the same time, the bare chip and the wire bonding joints of each layer ...

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Problems solved by technology

[0002] The three-dimensional packaging of precision electronic high-end chips, in addition to the general two-dimensional packaging technology, also uses complex packaging technologies such as multi-layer wiring or interlayer stacking and interconnection. These technologies make SiP chips from bare chips to packaging and printing The quality inspection of circuit boards has become more difficult

[0003] When using two-dimensional X-ray imaging technology to inspect three-dimensional packaged devices, because all layers of the three-dimensional packaged device are seen at the same time, the bare chip and the wire bonding joints of each layer will be superimposed on the X-ray image, so inspectors According to this X-ray image, the corresponding layer and position cannot be determined. Even if the oblique X-ray is used, this problem cannot be effectively solved, which brings great troubles to analysis and quality inspection.

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