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Improvements for electrical circuits

A conductive path and electric power technology, applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as "board" performance and reliability issues

Inactive Publication Date: 2014-02-05
普拉斯股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some performance and reliability issues with existing fabrication methods and the resulting "boards"

Method used

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  • Improvements for electrical circuits
  • Improvements for electrical circuits
  • Improvements for electrical circuits

Examples

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Embodiment Construction

[0040] First reference Figure 1 to Figure 4 , Shows four embodiments of the power conductive path according to the present invention. Figure 1 to Figure 4 The parts of the electrical conductive paths are shown separately for illustrative purposes only. It should be understood that the paths can be of any length and can have repeated patterns as needed. In each embodiment, the power conductive path includes a plurality of path portions connected end-to-end. For ease of reference, Figure 1 to Figure 4 Contains dashed lines, indicating the starting point and ending point of each path part.

[0041] For ease of reference, such as Figure 1 to Figure 4 Similar features in the illustrated embodiment are given the same reference numerals, accompanied by single, double or triple apostrophes ('). So see figure 1 Each passage portion includes a substantially straight first extension portion 11 and a substantially straight second extension portion 12. The first and second extension port...

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Abstract

The printed circuit board (PCB) interconnections comprise elongate sections 11 joined together by spring sections 14. The elongate sections extend at an inclined angle with respect to the longitudinal direction of the interconnection. The spring sections allow electrical connections to be maintained when the flexible circuit is subjected to stretching or bending. Multiple parallel interconnection patterns are also described. The bond between the conductive layer for forming the interconnections and the flexible substrate material is formed by applying pressure and heat.

Description

Technical field [0001] The present invention relates to the improvement of circuits, and in particular, to a circuit board used in power equipment. Background technique [0002] Circuit boards (often referred to as printed circuit boards or PCBs) are used in essentially all electrical equipment to support the electrical components and electrical conductive paths between them. Vias (often referred to as "tracks" or "traces") are generally etched from copper plates laminated on non-conductive surfaces, such as glass fiber sheets, supported. According to the design, the layer is superimposed on another layer, and electrical connections are generated between the paths of each layer, thereby providing power lines between power components. [0003] Due to the rigidity and strength of the glass fiber support layer, printed circuit boards or PCBs can provide mechanical support for power components and copper pathways, so it is the first choice for power lines and component support for mos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K2201/09263H05K1/118H05K1/0283H05K1/0271H05K3/02H05K3/022H05K3/38H05K3/4652H05K1/028
Inventor 普兰特·菲利普
Owner 普拉斯股份有限公司