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A marking and fluid flow technology, applied in the direction of hoses, pipes, piping systems, etc., can solve problems such as delay in connecting pipes, pipe identification, and inability to fall off marks, so as to reduce costs, save labor and time.
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[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It is an external perspective view showing a cutting device 2 using the pipe of the present invention for piping. On the front side of the cutting device 2 is provided an operating member 4 for an operator to input instructions to the device such as machining conditions. A display unit 6 such as a CRT is installed on the upper part of the device, and the display unit 6 displays a guidance screen for an operator and an image captured by an imaging unit described later.
[0035] like figure 2 As shown, on the surface of a light-emitting device wafer W (hereinafter, simply referred to as "wafer W") as a dicing object, first street (segmentation plan line) S1 and second street S2 are formed orthogonally. A plurality of devices D such as LEDs divided by the first spacer S1 and the second spacer S2 are formed thereon.
[0036] The wafer W is attached to a...
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