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Apparatus and methods for supporting and controlling a substrate

A substrate and substrate support technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as substrate thermal unevenness

Active Publication Date: 2014-02-12
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some cases, deformation of the substrate can lead to thermal non-uniformity across the substrate because the deformation causes different regions of the substrate to have different exposures to heat sources.

Method used

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  • Apparatus and methods for supporting and controlling a substrate
  • Apparatus and methods for supporting and controlling a substrate
  • Apparatus and methods for supporting and controlling a substrate

Examples

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Embodiment Construction

[0016] Embodiments of the present invention generally relate to methods and apparatus for processing substrates. Some embodiments of the present invention provide, inter alia, apparatus and methods for supporting a substrate during thermal processing. Embodiments of the present invention provide processing chambers that improve substrate control during processing by utilizing fluid flow to control substrates, utilizing adjustable fluid composition to adjust substrate temperature, and / or utilizing assistive forces to counteract the fluid flow to maintain the flatness of the substrate.

[0017] Figure 1A It is a schematic side cross-sectional view of a thermal treatment chamber 100 according to an embodiment of the present invention. Thermal processing chamber 100 is configured to perform rapid thermal processing of substrates.

[0018] Thermal processing chamber 100 includes sidewalls 102 , a chamber bottom 104 coupled to sidewalls 102 , and a quartz window 106 disposed over...

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Abstract

Embodiments of the present invention provide apparatus and methods for supporting and controlling a substrate during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes a chamber body defining an inner volume, a substrate support disposed in the inner volume, and an auxiliary force assembly configured to apply an auxiliary force to the substrate. Another embodiment provides a gas delivery assembly configured to adjust a thermal mass of a fluid flow delivered to position, control and / or rotate a substrate.

Description

technical field [0001] Embodiments of the present invention generally relate to apparatus and methods for processing substrates. More particularly, embodiments of the present invention provide apparatus and methods for supporting a substrate during thermal processing. Background technique [0002] During semiconductor processing, especially during thermal processing, substrates supported by conventional substrate supports may warp, bend or even break due to thermal gradients caused by rapid thermal heating. In some cases, deformation of the substrate can result in thermal inhomogeneity throughout the substrate because the deformation causes different regions of the substrate to have different exposures to the heat source. [0003] Accordingly, there is a need for an improved apparatus and method for supporting and controlling substrates during thermal processing. SUMMARY OF THE INVENTION [0004] Embodiments of the present invention generally provide apparatus and method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/205
CPCH01L21/6838H01L21/67109
Inventor 布莱克·凯尔梅尔约瑟夫·M·拉内什
Owner APPLIED MATERIALS INC
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