A low warpage solar cell back aluminum paste
A solar cell, low warpage technology, applied to conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve the problems of loss of heat shrinkage and cold expansion, metal antimony is easy to oxidize, and high sintering process requirements , to achieve the effect of reducing thermal expansion coefficient, improving warpage and reducing warpage
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Embodiment 1
[0023] The invention is a low-warp solar cell back aluminum paste, the components of which are calculated by weight percentage: 80% of aluminum powder, 7% of lead-free glass powder, 22.9% of organic carrier, and 0.1% of hollow glass microspheres. The particle size of glass microspheres is ≤6.5μm. The components of hollow glass microspheres include: 60% SiO 2 , 15%Al 2 o 3 , 15%Na 2 O, 5%ZrO 2 , 3%CaO, 2%MgO. The particle size of lead-free glass powder is ≤6.5μm, and the components include: 5%B by weight percentage 2 o 3 、85%Bi 2 o 3 , 2%ZnO, 5%SiO 2 , 3%MoO 3 .
Embodiment 2
[0025] The invention is a low-warp solar cell back aluminum paste, the components of which are calculated by weight percentage: 60% of aluminum powder, 0.5% of lead-free glass powder, 29.5% of organic carrier, 5% of hollow glass microspheres, pure metal Antimony powder 5%, the particle size of the hollow glass microspheres is 1.3~2.6μm, and the surface is treated with a coupling agent. The components of hollow glass microspheres include: 75% SiO 2 , 10%Al 2 o 3 , 10%Na 2 O, 4%ZrO 2 , 1% CaO. The particle size of lead-free glass powder is 1.3~6.5μm, and the components include: 15%B 2 o 3 、55%Bi 2 o 3 , 8%ZnO, 15%SiO 2 , 2%MoO 3 , 5%ZrO 2 .
Embodiment 3
[0027] The invention is a low-warp solar battery back aluminum paste, the components of which are calculated by weight percentage: 73% of aluminum powder, 4% of lead-free glass powder, 19.5% of organic carrier, 2.5% of hollow glass microspheres, surface coated 1% metal antimony powder coated with antimony trioxide, the particle size of the hollow glass microspheres is 1.3~2.6μm, and the surface is treated with a coupling agent. The particle size of hollow glass microspheres is 2.6~6.5μm, and the components include: 73% SiO 2 , 13%Al 2 o 3 , 11%Na 2 O, 1%ZrO 2 , 1.5%CaO, 0.5%MgO. The particle size of lead-free glass powder is 2.6~6.5μm, and the components include: 10%B 2 o 3 、67%Bi 2 o 3 , 3%ZnO, 13%SiO 2 , 5%MoO 3 , 2%ZrO 2 .
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Abstract
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