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Monolithic integrated circuit chip heating method

A monolithic integrated circuit, heating method technology, applied in the direction of circuit, electronic circuit test, electrical components, etc., can solve the problems of energy consumption, die heating, large temperature gradient, etc.

Inactive Publication Date: 2014-03-05
SUZHOU BATELAB MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in a previously known technique, at a reference voltage the power transistor turns on to dissipate energy, thereby heating the die
Since power transistors are generally located on a limited portion of the die, however, this technique creates localized heating and large temperature gradients across the die

Method used

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  • Monolithic integrated circuit chip heating method
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  • Monolithic integrated circuit chip heating method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0032] figure 1 A typical embodiment of the die heater of the present invention is shown. 10 is assembled on die 12, which includes reference voltage circuit 14, bond pad 16, scribe line area 18, heating resistor 20, first heater pad 22, second heater pad 24, input Power pad 26 , substrate pad 28 and output pad 30 .

[0033] Reference voltage circuit 14 includes circuit components comprised of reference voltages, such as a bandgap reference voltage. Substrate pad 28 , which contacts substrate 32 of die 12 , must be connected to prevent the substrate from being forward biased. If substrate 32 is p-type, for example, substrate pad 28 must be connected to a negative voltage supply (eg, ground). To activate the voltage reference 10, a direct current (DC) voltage is applied between the input power pad 26 and the pad 28 of the substrate, and the voltage reference circuit 14 produces a regulated output voltage V at the output pad 30. OUT .

[0034] The heating resistor 20 is fab...

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PUM

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Abstract

The invention discloses a monolithic integrated circuit chip heating method and provides an integrated circuit chip containing a metal heating electric resistor. In an embodiment of the invention, the metal heating electric resistor is arranged on the periphery of the outer circumference of the circuit chip, one end of the metal heating electric resistor is connected to a first bonding pad, and the other end of the heating electric resistor is connected to a second pad. In an alternative embodiment, an improved heating contact between the heating electric resistor and a chip substrate is arranged between the first end and the second end of a metal substrate contact along the heating electric resistor. In other alternative embodiments, the metal heating electric resistor is measured through the temperature coefficients of the arranged peripheral circuit, for example, one part of a larger integrated circuit containing other circuits contains a reference voltage circuit.

Description

Technical field: [0001] The present invention relates to semiconductor integrated circuits. More specifically, the present invention relates to methods and apparatus for rapidly and uniformly heating circuit parameters of an integrated circuit die to measure temperature coefficients. Even more particularly, the present invention relates to methods and apparatus for heating an integrated circuit die to measure the temperature coefficient of an output voltage of a reference voltage circuit. Background technique: [0002] Many types of electronic circuits, such as digital-to-analog converters, voltage regulators, and precision amplifiers, require a temperature-independent bias reference. The stable reference can be a current or a voltage. For most applications, a reference voltage is preferred because of its ease of interfacing with other circuits. [0003] High precision voltage reference that achieves temperature stability of less than 10 parts per million per degree Celsi...

Claims

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Application Information

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IPC IPC(8): H01L23/34G01R31/28
Inventor 李志鹏
Owner SUZHOU BATELAB MICROELECTRONICS