A kind of dispensing device and solid crystal machine

Abstract

The invention discloses a glue dispensing device and a die-bonding machine. In the glue dispensing device, a glue container, a glue channel and a glue dispensing nozzle are connected in sequence to form a closed system; a driving component includes a motor and a thread driven by the motor. a shaft, the threaded shaft is connected with the output shaft of the motor through a transmission mechanism, and at least the threaded part of the threaded shaft is inserted into the glue channel and tightly fits with the glue channel to form a threaded channel; the motor The threaded shaft is driven to rotate, so as to drive the glue in the glue container to enter the glue dispensing nozzle from the threaded channel and output from the glue dispensing nozzle. Through the above method, the present invention can reduce the probability of the glue being oxidized and the degree of oxidation during the dispensing process, and can effectively control the dispensing amount.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to a glue dispensing device and a solid crystal machine. Background technique [0002] A die bonder is an automated die bonder that fixes wafers on a product, usually including a dispensing device and a die bonder. The dispensing device is used to place glue on the product. When the dispensing device dispenses glue at the dispensing position of the product, the die-bonding device puts the corresponding wafer into the dispensing position, so that the wafer is attached to the product. Glue to realize the fixation of wafer. [0003] In the dispensing device of the existing crystal bonder, the dispensing method is generally to drive the dispensing nozzle to take glue from the silver paste tray through the dispensing arm. After the dispensing nozzle takes the slurry, the dispensing arm drives the dispensing nozzle to the dispensing position for dispensing. [0004] The above-menti...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned dispensing method needs to place the glue in the silver paste tray in advance, and the silver paste tray is usually exposed to the air so that the dispensing nozzle can take the glue in the silver paste tray, which leads to the glue in the silver paste tray Direct contact with air for a long time makes the glue easy to be oxidized

The adhesive force of the oxidized glue is greatly reduced, making it difficult to fix the wafer, resulting in a decline in product quality, and even the oxidized glue may harden and form a hard block, which will cause the dispensing nozzle to fail to pick up the glue and cause a large amount of glue waste

In addition, the above method of dispensing glue takes glue from the silver paste tray through the dispensing nozzle, and the dispensing nozzle has a limited amount of glue, which cannot meet the occasions where the dispensing amount is large, and it is also difficult to control the dispensing amount

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