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Circuit boards with embedded components and electromagnetic shielding

A technology of electromagnetic barriers and embedded components, which is applied in the direction of printed circuits, circuits, and electrical components connected by non-printed electrical components, which can solve the problems of misplacement of semiconductor components, low yield, and poor alignment, reaching a high 1/ O value, high performance, low price effect

Inactive Publication Date: 2016-08-17
BRIDGE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This structure ensures excellent electrical shielding of embedded components in a small space, but the depth of the conductive blind via needs to be as thick as the semiconductor component, so the drilling and coating of the hole is limited by the high aspect ratio, and can only accommodate some super thin components
In addition, since the recessed part as the chip placement area is formed after the metallization of the conductive blind hole, the misalignment of the semiconductor element is caused due to poor alignment, which in turn makes this method extremely low in mass production.

Method used

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  • Circuit boards with embedded components and electromagnetic shielding
  • Circuit boards with embedded components and electromagnetic shielding
  • Circuit boards with embedded components and electromagnetic shielding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Figure 1-8 It is a cross-sectional view of a manufacturing method of a circuit board according to an embodiment of the present invention, wherein the circuit board includes a semiconductor element, a shielding frame, a strengthening layer and double build-up circuits.

[0052] like Figure 8 As shown, the circuit board 100 includes a semiconductor element 31 , a shielding frame 114 , a strengthening layer 41 , a first build-up circuit 201 , and a second build-up circuit 202 . The semiconductor device 31 includes an active surface 311 , an inactive surface 313 opposite to the active surface 311 , and a contact pad 312 on the active surface 311 . The first build-up circuit 201 includes a first insulating layer 211 and a first wire 215 , and is electrically connected to the semiconductor element 31 and the shielding frame 114 through a first conductive blind hole 217 . The second build-up circuit 202 includes a second insulating layer 221 , a shielding cover 224 and a se...

Embodiment 2

[0069] Figure 9-14 It is a cross-sectional view of another circuit board manufacturing method according to another preferred embodiment of the present invention, wherein the circuit board includes a shielding cover, which is electrically connected to a shielding frame through a conductive trench; wherein Figure 13A for Figure 13 bottom view.

[0070] For the purpose of brevity, any statement in Example 1 may be incorporated into the same application section here, and the same statement will not be repeated.

[0071] Figure 9 By Figure 1-3 The structure is fabricated by the same steps as shown, except that the semiconductor device 31 is disposed on the dielectric layer 13 with the inactive surface 313 facing the dielectric layer 13 . In this figure, the shielding frame 114 laterally covers the side surface of the semiconductor device 31 and is coplanar with the active surface 311 of the semiconductor device 31 in the upward direction. Moreover, in some implementation ...

Embodiment 3

[0080] Figure 15-17 It is a cross-sectional view of yet another circuit board manufacturing method according to another preferred embodiment of the present invention, wherein the circuit board includes covered through holes for grounding of the shielding cover.

[0081] For the purpose of brevity, any statement in the above embodiments may be incorporated into the same application section here, and the same statement will not be repeated.

[0082] Figure 15 so Figure 1-6 The structure formed by the same steps is shown.

[0083] Figure 16 It is a cross-sectional view of the structure having the first blind hole 213 and the through hole 511 . The first blind hole 213 extends through the support plate 15 , the first insulating layer 211 and the adhesive 16 to expose the contact pad 312 and a selected portion of the shielding frame 114 . The through hole 511 extends vertically through the support plate 15 , the first insulating layer 211 , the strengthening layer 41 , the...

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PUM

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Abstract

The invention provides a circuit board with embedded components and electromagnetic shielding. In a preferred embodiment of the present invention, the circuit board with embedded components and electromagnetic shielding includes: a shielding frame, a semiconductor element, a strengthening layer, a first build-up circuit and a second build-up circuit with a shield cover. The first and second build-up circuits cover the semiconductor element, the shielding frame and the reinforcement layer in opposite vertical directions, the shielding frame and the shielding cover are electrically connected to at least one ground contact pad of the semiconductor element through the first build-up circuit, and the shielding frame The shielding cover and the shielding cover can respectively effectively serve as horizontal and vertical electromagnetic shields for the semiconductor elements located in the through holes of the strengthening layer.

Description

technical field [0001] The invention relates to a circuit board with built-in components and electromagnetic shielding, especially a circuit board suitable for having a shielding frame and a shielding cover, wherein the shielding frame and the shielding cover can be used as horizontal and vertical barriers for the built-in components respectively . Background technique [0002] Semiconductor components are susceptible to electromagnetic interference (EMI) or other internal components such as capacitive, inductive, conductive coupling when operating in high frequency mode. The severity of these undesirable interferences can increase substantially when semiconductor chips are placed in close proximity to each other for miniaturization. To reduce electromagnetic interference, shielding may be required on certain semiconductor components and modules. [0003] U.S. Patent No. 8,102,032 to Bolognia et al., U.S. Patent No. 8,105,872 to Pagaila et al., U.S. Patent No. 8,093,691 to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/552H01L23/538H05K1/02H05K1/18
CPCH01L24/19H01L2224/04105H01L2224/73267H01L2224/8314H01L2224/92144H01L2924/3025H01L2224/32225H01L2224/92244H01L2224/19H01L2924/3511H01L2924/00012
Inventor 林文强王家忠
Owner BRIDGE SEMICON