Circuit board with embedded component and electromagnetic shielding
A technology of electromagnetic barriers and embedded components, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve problems such as poor alignment and low yield, and achieve high I/O value, high performance, and reduced electromagnetic interference. Effect
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Embodiment 1
[0034] Figure 1 to Figure 5 It is a cross-sectional view of a manufacturing method of a circuit board according to a preferred embodiment of the present invention. The circuit board includes a spacer, a semiconductor element, a core layer, a shield cover, a shield slot, a terminal, a build-up circuit and a covered through hole 515 .
[0035] like Figure 5 As shown, the circuit board 100 includes a spacer 123 , a semiconductor element 31 , a core layer 41 , a shield cover 224 , a shield slot 414 , a terminal 222 , a build-up circuit 201 , and a covered through hole 515 . The semiconductor device 31 includes an active surface 311 , an inactive surface 313 opposite to the active surface 311 , and a contact pad 312 located on the active surface 311 . The positioning member 123 is disposed outside the peripheral edge of the semiconductor device 31 and close to the peripheral edge of the semiconductor device 31 . The core layer 41 laterally covers the spacer 123 and the semicondu...
Embodiment 2
[0047] Figure 6 to Figure 15 It is a cross-sectional view of another circuit board manufacturing method according to another preferred embodiment of the present invention. The circuit board includes a spacer, a semiconductor element, a core layer, a shield cover, a shield slot, a double build-up circuit and a covered through hole.
[0048] For the purpose of brevity, any statement in Example 1 may be incorporated into the same application section here, and the same statement will not be repeated.
[0049] Image 6 is a cross-sectional view of a laminated substrate, which includes a metal layer 11 , a dielectric layer 13 , and a support plate 15 . The dielectric layer 13 is generally made of epoxy resin, glass epoxy resin, polyimide, and the like, and has a thickness of 50 microns. In this embodiment, the dielectric layer 13 is interposed between the metal layer 11 and the support plate 15 . However, the support plate 15 may be omitted in some aspects. The support plate 15...
Embodiment 3
[0061] Figure 16 to Figure 21 It is a cross-sectional view of another circuit board manufacturing method according to another preferred embodiment of the present invention. The circuit board includes a shielding slot electrically contacting with the positioning member.
[0062] For the purpose of brevity, any statement in Example 1 may be incorporated into the same application section here, and the same statement will not be repeated.
[0063] Figure 16 for the reason Figure 1 to Figure 3 A cross-sectional view of the structure fabricated by the same steps is shown.
[0064] Figure 17 It is a cross-sectional view of the structure having the first blind hole 213 and the narrow hole 411 . The first blind hole 213 extends through the metal layer 21 and the first insulating layer 211 to expose the contact pad 312 of the semiconductor device 31 . The narrow hole 411 extends through the metal layer 21 , the first insulating layer 211 and the core layer 41 to expose a select...
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